Tango Systems, Inc. the innovator in high performance, cost-effective sputtering systems
extends technology from Small-Batch-Cluster tools to Single-Wafer-Cluster. The
Axcela™ 450 is the first in a new line of single wafer advanced processing modules,
based on the highly successful Axcela™ 200/300 platforms that are currently used in
high-volume production across the globe.
In the last few years, Tango’s in-house Axcela™ 450 system has already produced over
1,000 of 450mm wafers. Today, Tango’s Axcela™ 450 serves as a most sought-after
PVD platform for several groundbreaking technology R&D and C&F efforts ongoing at
major supply chain members. As the 450mm market continues to evolve, Tango is
positioning itself to emerge as a global leader with its core competence in nano-films
fabrication with excellent uniformity, thickness control and step coverage, coupled with
advanced process control and remote diagnostics.
Over the last decade, Tango’s flexible Axcela™ 200/300 series has been serving the
semiconductor and thin film magnetic head industries with multi-layer Ultra-thin films,
Interposers and TSV applications, all with the industry’s lowest Cost of Ownership. The
combination of single wafer and Small-Batch-Cluster architectures, coupled with the
patent protected D-Source magnetron technology enables the customer to choose
configurations based on application needs.