Table of Contents

Solid State Technology

Volume 56, Issue 5
  • Features

    • Cover Article

      • FD-SOI targets mobile applications

        The FD-SOI technology platform is perfectly suited for mobile IC applications where power consumption has to be very low to maximize battery lifetime. GIORGIO CESANA, STMicroelectronics, Crolles, France and CARLOS MAZURE, Soitec, Bernin, France

    • Metrology

    • Automation

    • 3D Integration

      • Paradigm changes in 3D-IC manufacturing

        The process flows applied today for real product manufacturing are quite different from the process flows initially proposed for a universal 3D IC. THORSTEN MATTHIAS and PAUL LINDNER, EV Group, St. Florian, Austria

    • Semicon West

  • Columns

    • Edtorial

    • Packaging

      • Inside ASET's Dream Chip

        The International Symposium on Electronic Packaging was held in Osaka the week of April 10th with keynote speakers, Dr. Subramanian S. Iyer of IBM, Dr. Takeshi Uenoyama of Panasonic, and Dr. Urmi Ray of Qualcomm.

    • MEMS

      • MEMS: After the prototype

        After a functional A-sample prototype is built, it doesn't take long for a project to gain traction that has market pull.

    • Industry Forum

      • Learning the secrets of design for yield

        Random process variations and layout-dependent effects are a fact of life for designers working at the more advanced process nodes and become critical at 45nm. Besides random and systematic variation effects, reliability effects, such as bias-temperature-instability (BTI), also become prevalent, introducing another dimension of variations that impact parametric yield.

  • Departments

    • New Products
    • News

      • Abu Dhabi doubles down on semiconductor research

        The Advanced Technology Investment Company (ATIC) and the Semiconductor Research Corporation (SRC) last month launched the ATIC-SRC Center of Excellence for Energy Efficient Electronic Systems (ACE4S), to be hosted jointly in Abu Dhabi by Khalifa University of Science, Technology and Research, and Masdar Institute of Science and Technology.

      • GLOBALFOUNDRIES unveils plans to accelerate adoption of 20nm-LPM and 14nm-XM finFET processes

        At the 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES unveiled a comprehensive set of certified design flows to support its most advanced manufacturing processes.

      • Bosch and STM tie for No. 1 MEMS supplier of 2012

        For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian STMicroelectronics ending up evenly splitting the title of No. 1 supplier for the year, according to a MEMS Competitive Analysis Report from information and analytics provider IHS.

      • Fab equipment spending: 23% growth in 2014

        Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion), according to the May edition of the SEMI World Fab Forecast.


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Electroiq 2 EIQ2


ROFIN presents turnkey solutions for FEOL applications

July 2, 2013 The new laser wafer processing system Waferlase 200/300/450, is a fully automated modular platform comprising a market-leading ...

EV Group launches new LowTemp room temperature debonding platform

July 1, 2013 EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today i...

All-in-one microscope for advanced imaging, recording and measurement

June 7, 2013

Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope.

Olympus launches LEXT OLS4100 laser confocal microscope

June 7, 2013

New 3D measuring system offers auto brightness and high-speed stitching.


Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...


Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...


Tackling Design for Yield Questions at DAC

Wed May 22 15:39:00 CDT 2013

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012

The ConFab 2013 countdown begins

Thu Aug 09 16:18:00 CDT 2012



Volume 56, Issue 4

Article Archive for Solid State Technology.

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