Semiconductor Featured Articles

GaN nanowires grow straight in sapphire grooves

Nanowires tend to grow in unruly tangles, but a new structured substrate from the Weizmann Institute of Science is producing long, straight, aligned semiconductor nanowires for LEDs, photovoltaics, lasers, transistors, storage media, and other applications.

OLED materials patents grew 200% in 2 years

Cintelliq research shows the fastest growth in OLED patents 2008-2010 came from the materials sector. During the 2-year period, the total number of OLED patents published grew by 56% from 1,767 to 2,760, with no signs of slowing. The largest group of OLED patents went to traditional lighting companies.

Imec performs selective CVD of GeSN

Imec highlights recent research on using CVD, and commercially available precursors, to grow GeSn in a manner that could be replicated on 200mm and 300mm wafer production environments.

Diverse touchscreen technologies drive industry transition

Displaybank report on capacitive touch panel technology, structures and manufacturing process trends: capacitive touch panels without separate touch sensors, and a move away from film-based and single-layer glass-based panels.

Nano pillar collapse enables 10nm e-beam lithography patterns

MIT and A*STAR have demonstrated a new technique that could produce 10nm chip features using plastic pillar deposition and predetermined pillar collapses.

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Semiconductor Current Articles

Chip sales, capex growth slowing, says IC Insights

Sep 16, 2011

Techcet's Michael A. Fury shares some bullet-point analyses from IC Insights' Fall Forecast Seminar in Sunnyvale, CA, where the firm offered its latest take on semiconductor sales, capex, and application growth for 2011 and 2012.

Leading-edge semiconductor materials research at TECHCON 2011

Sep 16, 2011 In video blogs from this week's TECHCON 2011, students share their current research projects from lead-free solder to graphene for new transistors, and members of industry giants like IBM share how SRC-supported research benefits the industry.

CMP for hard-disk drives spotlighted at NCCAVS CMPUG

Sep 15, 2011 Techcet's Michael A. Fury reports from a NCAAVS CMP user group meeting in San Jose, CA, with the overall theme of CMP for the hard-disk drive industry: market outlooks for HDDs, different requirements and challenges vs. IC manufacturing, and new t...

Honeywell doubles semiconductor Cu and Sn production

Sep 15, 2011

Honeywell (NYSE:HON) Electronic Materials will more than double refining and casting capacity for high-purity copper and tin at its Spokane, WA, facility, citing increased demand from memory and semiconductor packaging sectors.

IEDM 2011 presentations preview

Sep 14, 2011 The annual IEEE International Electron Devices Meeting (IEDM) will convene in Washington, D.C., December 5-7 at the Hilton Washington Hotel. This year’s IEDM boasts strong technical presentations alongside new features such as tutorial sessions fo...

Semiconductor Industry News

Negative 2011 semiconductor industry growth is possible, warns Gartner

Sep 15, 2011 Jim Walker, VP, Research of Semiconductor Manufacturing and Emerging Technologies, at Gartner, speaks with Solid State Technology about revising Ga...

Stanford, UC Berkeley profs win SRC awards

Sep 15, 2011 Update: Video interviews with the award winners. Semiconductor Research Corporation (SRC) bestowed its Aristotle and Technical Excellence awards on...


Sep 14, 2011 In this special event coverage of Semiconductor Research Corporation's TECHCON conference, we feature video interviews with students and professors...

3M invests in Pixel Qi LCD technology

Sep 14, 2011 3M, via the 3M New Ventures organization, invested an undisclosed sum in Pixel Qi Corp., a fabless LCD panel developer a low-power, sunlight-readab...

SEMICON Europa preview

Sep 13, 2011 SEMICON Europa 2011 will take place October 11-13 at Messe Dresden in Dresden, Germany. The event covers new technologies and products for advanced...

Semiconductor Wire News


Sep 17, 2011

GENEVA, Sept. 17 -- Publication No. WO/2011/111502 was published on Sept. 15.

Title of the invention: "DISPLAY DEVICE."

Panasonic Assigned Patent for Semiconductor Device and Manufacturing Method

Sep 17, 2011 ALEXANDRIA, Va., Sept. 17 -- Panasonic, Osaka, Japan, has been assigned a patent (8,018,004) developed by Yoshihiro Sato, Hyogo, Japan, and Hisashi Ogawa, Osaka, Japan, for a "s...

Hitachi ULSI Systems, Hitachi Assigned Patent

Sep 17, 2011 ALEXANDRIA, Va., Sept. 17 -- Hitachi ULSI Systems, Tokyo, and Hitachi, Tokyo, have been assigned a patent (8,018,006) developed by Mitsuru Arai, Kodaira, Japan, Shinichiro Wada,...

Panasonic Assigned Patent for Semiconductor Device

Sep 17, 2011 ALEXANDRIA, Va., Sept. 17 -- Panasonic, Osaka, Japan, has been assigned a patent (8,017,975) developed by four co-inventors for a semiconductor device. The co-inventors are Keii...

Panasonic Assigned Patent for Semiconductor Device, and Energy Transmission Device Using the Same

Sep 17, 2011 ALEXANDRIA, Va., Sept. 17 -- Panasonic, Osaka, Japan, has been assigned a patent (8,017,996) developed by Saichirou Kaneko, Kyoto, Japan, for a "semiconductor device, and energy...

Samsung Electronics Assigned Patent for Inorganic Electroluminescent Diode and Method of Fabricating the Same

Sep 17, 2011 ALEXANDRIA, Va., Sept. 17 -- Samsung Electronics, South Korea, has been assigned a patent (8,017,952) developed by four co-inventors for an "inorganic electroluminescent diode a...

US Patent Issued to STATS ChipPAC on Sept. 13 for "Semiconductor Device and Method of Forming Compliant Polymer Layer Between Ubm and Conformal Dielectric Layer/rdl for Stress Relief" (Singaporean Inventors)

Sep 17, 2011 ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 8,017,515, issued on Sept. 13, was assigned to STATS ChipPAC Ltd. (Singapore). "Semiconductor Device and Method of Forming ...

US Patent Issued to National Semiconductor on Sept. 13 for "Selectable Power Fet Control for Display Power Converter" (New York Inventors)

Sep 17, 2011

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 8,018,176, issued on Sept. 13, was assigned to National Semiconductor Corp. (Santa Clara, Calif.).

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    Exclusive Podcast Interviews

    Cymer litho VP Nigel Farrar shares product updates

    07/14/2011 Nigel Farrar, Cymer, provides a status report on EUV lithography source technology, extensions to ArF lithography, the laser crystallization proces...

    Amir Azordegan, senior director of marketing for Surfscan at KLA-Tencor

    07/11/2011 Amir Azordegan, senior director of marketing for Surfscan at KLA-Tencor, explains how KLAC's Surfscan SP3 DUV wafer inspection platform detect...

    Greg Baker, president and COO of Olympus Integrated Technologies America

    07/11/2011 Greg Baker, president and COO of Olympus Integrated Technologies America, discusses why the company chose to focus its efforts on infrared (IR) met...

    Undoped, deeply depleted channel rivals FDSOI, FinFETs, says Scott Thompson, SuVolta

    06/06/2011 June 6, 2011 -- SuVolta is tackling the low-power challenge of mobile SoC devices with its PowerShrink platform and undoped, deeply depleted channe...

    How the combinatorial method is evolving, with ATMI

    05/31/2011 What's driving the semiconductor industry to new materials R&D methods? Combinatorial methods (high-productivity development research) can shor...

    ElectroIQ Blog

    Read opinions/analysis on the day's news, tradeshow updates, and more. We blog about solar, semiconductor, advanced packaging and nanotech manufacturing industries.

    Key takeaways from IDF: Ultrabooks and phones

    The big theme of this year's Intel Developer Forum (IDF) was about mobile technology, now and coming in the near future. Barclays' CJ Muse wraps up his key takeaways.Ultrabooks. Intel wants to have a ~$1000 ultrabook on shelves in time for the 20... Read More>>


    Solid State Technology - Current Issue

    Sep 2011
    Volume 54, Issue 8

    Semiconductor Chips Blog

    Intel Enlarges Process Lead over Their Competition

    22-nm Trigate Transistors DiscussedAt a morning session at the Intel Developer Forum Tuesday, Mark Bohr tooted the Intel trumpet and put a slide up to emphasise their lead over the other leading semiconductor companies:Intel Process Evolution Sinc... Read More>>

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    The most important element in the microelectronics performance, be it low power, electrical performance or reliability, is the interconnect from the chip to the package. As the power to drive the s...

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