More MEMS Packaging and Testing Articles

MEMS testing units bolster Rasco product line with high parallelism

Jul 15, 2011

Rasco GmbH, a Cohu Inc. (NASDAQ: COHU) subsidiary, added the Pressure Test Unit (PTU) and the Acoustic Test Unit (ATU) to its line of testers for MEMS ICs.

MHI 8" wafer bonder produces 3D LSI ICs at room temp with FAB gun

Jul 13, 2011 Mitsubishi Heavy Industries Ltd. (MHI) developed a fully automated 8" wafer bonding machine that bonds large-scale integration (LSI) circuits at room temperature, creating 3D ICs.

CEA-Leti improves MEMS reliability with new packaging, ruthenium

Jul 12, 2011 CEA-Leti has revamped its RF MEMS manufacturing for higher reliability and performance, using thin-film packaging and replacing gold with ruthenium for the contacts. The design also prevents contac...

Gold pattern transfer/bonding tech for MEMS, LED packaging under dev at SUSS, Tanaka

Jul 12, 2011 Tanaka Kikinzoku Kogyo KK will partner with SUSS MicroTec KK to develop pattern transfer and bonding technology using sub-micron gold particles. The companies hope to replace gold bumping, sputteri...

Olympus inspects bonded wafers with IR microscopy

Jul 12, 2011 Greg Baker, Olympus Integrated Technologies America, discusses why the company chose to focus its efforts on IR metrology for defect inspection of bonded wafers. Olympus-ITA launched the latest 3DI...

Nordson ASYMTEK film-frame packaging workcell improves MEMS, wafer dicing

Jul 11, 2011

Nordson ASYMTEK introduced the MH-910W automated workcell for film-frame wafer-level packaging applications, such as capping MEMS die and coating wafers prior to laser dicing.

Parylene protects MEMS assemblies

Jun 29, 2011 The latest developments in parylene have produced new formulations that offer even smaller molecular structures and superior thermal, UV and dielectric protection. Parylene conformal coating protec...

Dolomite debuts microfluidics connector line

Jun 22, 2011

Dolomite, microfluidic device maker, designed the Multiflux range of microfluidic connectors and interfaces.

MEMS wafers characterized by Zebraoptical integrated metrology tool

May 24, 2011 Sunrise Optical LLC debuted the Zebraoptical low coherence fiber optic interferometer with microscope attachment. The Zebraoptical Integrated Metrology Tool (ZIMT) provides metrology readings on mi...

Wafer bonding: Many options for many devices

May 17, 2011 Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and...

Optical systems capture microfluidic experiment data

Apr 13, 2011 Dolomite launched a range of optical systems that capture high-quality still and moving images of microfluidic experiments. Applications include testing various microfluidic chips for droplet gener...

Agilent NanoSuite software improves nano indentation, tensile testing

Apr 7, 2011 NanoSuite 6.0 promises speed, flexibility, ease of use and new application methods for nanomechanical properties measurements involving polymers, composites, thin film materials, MEMS, surface topo...

Hermetic wafer-level packaging lowers cost with IMT Au-Au bond

Mar 8, 2011

IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.

Dolomite chip holder allows microfluidic temperature control

Feb 14, 2011 Dolomite, microfluidic designer and manufacturer, expanded its range of temperature control systems with the Hotplate Adaptor - Chip Holder H, which allows control over internal temperatures of mic...

Helios Crew SemiLEDs intros LED packaged with MEMS

Feb 2, 2011 Helios Crew Corporation (HCC) Taiwan released its LED product S35, a packaged component LED that integrates MEMS with semiconductor processing to produce a unique silicon packaging technology.

3D MEMS profiler from E M Optomechanical

Jan 24, 2011 E M Optomechanical Inc. (EMOpto) developed a new low-cost version of its OPTOPro line of 3D MEMS Optical Profilers for use in testing and characterizing MEMS devices. The OPTOPro Model 622-Xe enabl...

Wafer level packaging of image sensors

Jan 1, 2011 Wafer-level packages that use a glass cover over the package cavity and through-silicon vias to interconnect the die bond pads satisfy the packaging requirements for CMOS image sensors: compact, re...

MEMS packaging conference planned for 2011

Dec 28, 2010 The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highli...

MEMS packaging conference planned for 2011

Dec 28, 2010 The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highli...

IEDM Preview: CMOS imager works from light to night

Oct 22, 2010 At the upcoming IEDM conference in December, researchers from NoblePeak Vision will explain how they achieved the first large-scale integration of a single-crystal germanium photodiode into a silic...

New 'community' launched with a focus on MEMS

Apr 21, 2003 In an effort to facilitate input for future trends, information, and new techniques, SUSS MicroTec and Danish Electronics, Light & Acoustics (DELTA) have launched MEMUNITY, a community, or knowledg...