TSV electroplating dev team unites SVTC, Amerimade Technology, Shanghai Sinyang Semiconductor Materials
Oct 19, 2011
Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will co...
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Nantong Fujitsu Microelectronics installs NEXX tool for copper pillar, RDL packaging
Oct 19, 2011
NEXX Systems shipped a Stratus electrochemical deposition tool to Nantong Fujitsu Microelectronics Co. Ltd. (NFME), based in Jiangsu province, China. NFME wi...
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SUSS MicroTec wins thin-wafer temporary bonder order
Oct 18, 2011
SUSS MicroTec, in partnership with temporary bonding adhesive maker TMAT, will deliver SUSS MicroTec's new-generation high-volume temporary wafer bond tool c...
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Smartphone DRAM surges with higher DRAM density and increased adoption
Oct 18, 2011
DRAM shipments for smartphones will grow 157.2% year-over-year in 2011, a surging sector of a slumping DRAM industry, shows IHS. By 2015, DRAM for smartphone...
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Air-cooled wafer probe chuck debuts in modular format
Oct 17, 2011
ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems. |
MVTS expands in California, Malaysia, and Taiwan
Oct 18, 2011
MVTS Technologies opened new offices in San Jose, CA; Penang, Malaysia; and Hsinchu, Taiwan to support growing demand for test, assembly, and other IC production equipment and s...
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iPhone 4S first with 5-lens autofocus camera, other component changes
Oct 17, 2011
IHS and Chipworks share details from their preliminary teardowns of the Apple iPhone 4S. The device resembles an iPad/iPhone hybrid, and the 5-lens autofocus camera module is th...
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IMAPS: Markovich takes reins, Jones given Lifetime Achievement Award
Oct 14, 2011
At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the reins as the organiz...
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IMAPS semiconductor packaging award bestowed on Nordson Asymtek's Adamson
Oct 14, 2011
Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and the microelectronics...
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Fraunhofer IZM's packaging center installs Altatech CVD
Oct 11, 2011
All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), with diameters as smal...
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NEXX Systems Secures Order From China's Nantong Fujitsu; Deal broadens company's presence in China
Oct 20, 2011
In a move that expands its customer base in China, NEXX Systems shipped a Stratus electrochemical deposition tool to a leading IC manufacturer, Nan...
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DDD Group PLC Licensing Agreement
Oct 20, 2011
RNS Number : 5108Q DDD Group PLC 20 October 2011 20 October 2011 DDD Group PLC ViewSonic launches 3D monitor with DDD's TriDef(R) 3D technology Lo...
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Northstar Electronics Provides Company Update, Including $6M in Current Contracts
Oct 20, 2011
Northstar Electronics, Inc. (OTCBB:NEIK) is providing a company update to shareholders in regards to active and outstanding business for Q4, 2011 a...
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SAMSUNG, GOOGLE UNVEIL DELAYED SMARTPHONE
Oct 20, 2011
Samsung Electronics Co. (KSE:005930) and Google Inc. on Wednesday announced a major update to Android software and the new Nexus smartphone after t...
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Ozmo Devices Ships One Million Wi-Fi Chips; Highlights Rapid Adoption of Wi-Fi for Peripheral Connectivity
Oct 20, 2011
Ozmo Devices, the leading provider of low-power Wi-Fi Personal Area Network (Wi-Fi PAN) solutions, announced today that it has achieved a key indus...
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Four Sanmina-SCI Manufacturing Facilities Receive Highest Level Military Certifications; New Certifications Enable Expanded Partnerships with Defense and Aerospace Customers
Oct 20, 2011
Sanmina-SCI Corporation (Nasdaq: SANM), a leading manufacturing solutions company making some of the world's most complex and valuable electronic a...
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OASIS to Define Trust Elevation Standard for Authenticating e-Identity Credentials; Advanced Micro Devices, Axiomatics, Bank of America, BiTKOO, Boeing, Booz Allen Hamilton, CA Technologies, Intel, JPMorgan Chase Bank, New Zealand Government, OIX, Red Hat, SafeNet, Tiani "Spirit", US National Institutes of Health (NIH), US National Institute of Standards and Technology (NIST), US Veterans Health Administration, and Others Work to Ensure Trust in Online Transactions
Oct 20, 2011
The OASIS international open standards consortium has begun work to define a set of standardized protocols that online service providers may use to...
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Lockheed to maintain Army aerostats
Oct 20, 2011
The U.S. Army has given Lockheed Martin a $383 million contract to maintain, operate and sustain tethered, aerostat Persistent Threat Detection Sys...
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3-D Architectures for Semiconductor Integration and Packaging ConferenceSan Francisco, CA
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Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
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Ziptronix low-temp direct oxide bonding scales pixels to 0.7µm width
09/27/2011
In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the Zipt...
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Sitaram Arkalgud presents SEMATECH packaging survey results
07/14/2011
Sitaram Arkalgud, director of interconnect at SEMATECH, discusses the high-volume manufacturability issues and gaps in both 2.5D and 3D semiconduct...
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Greg Baker, president and COO of Olympus Integrated Technologies America
07/11/2011
Greg Baker, president and COO of Olympus Integrated Technologies America, discusses why the company chose to focus its efforts on infrared (IR) met...
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Henkel research scientist speaks on HB-LED packaging
04/01/2011
Daniel Duffy, Henkel's Advanced Technology Group, speaks on epoxy and silicone encapsulants, what high-brightness LED (HB-LED) manufacturers need f...
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MonolithIC 3D exec talks gate-last, dropping NuPGA
03/31/2011
Zvi Or-Bach, was interviewed by ElectroIQ about his latest startup, MonolithIC 3D. The costs associated with scaling "up" to 3D ICs are d...
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