Packaging Featured Articles

EVG enhances fusion wafer bonder throughput, accuracy

EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.

Rudolph: NSX package inspection system sales top 1000

Rudolph Technologies Inc. (NASDAQ:RTEC) shipped the 1000th NSX Inspection System from its Bloomington, MN manufacturing facility. The NSX inspects wafer bumps, WLP, MEMS, and more.

Ushio 200mm litho tool suits 3D packaging steps

Ushio Inc. debuted a 200mm wafer full-field projection lithography tool UX4-3Di FFPL 200 for high-volume manufacturing of advanced LSI devices incorporating 3D integration technologies, such as TSVs and silicon interposers and bumps.

Invensas demos DFD implementation of its xFD technology

Invensas president Simon McElrea explains the company's new wire bond-based multi-die face-down (xFD) packaging technology, demo'd at this year's Intel Developer Forum, and its advantages in terms of performance and manufacturing cost reductions.


Packaging Current Articles

TSV electroplating dev team unites SVTC, Amerimade Technology, Shanghai Sinyang Semiconductor Materials

Oct 19, 2011 Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will co...

Nantong Fujitsu Microelectronics installs NEXX tool for copper pillar, RDL packaging

Oct 19, 2011 NEXX Systems shipped a Stratus electrochemical deposition tool to Nantong Fujitsu Microelectronics Co. Ltd. (NFME), based in Jiangsu province, China. NFME wi...

SUSS MicroTec wins thin-wafer temporary bonder order

Oct 18, 2011 SUSS MicroTec, in partnership with temporary bonding adhesive maker TMAT, will deliver SUSS MicroTec's new-generation high-volume temporary wafer bond tool c...

Smartphone DRAM surges with higher DRAM density and increased adoption

Oct 18, 2011 DRAM shipments for smartphones will grow 157.2% year-over-year in 2011, a surging sector of a slumping DRAM industry, shows IHS. By 2015, DRAM for smartphone...

Air-cooled wafer probe chuck debuts in modular format

Oct 17, 2011

ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems.

Packaging Industry News

MVTS expands in California, Malaysia, and Taiwan

Oct 18, 2011 MVTS Technologies opened new offices in San Jose, CA; Penang, Malaysia; and Hsinchu, Taiwan to support growing demand for test, assembly, and other IC production equipment and s...

iPhone 4S first with 5-lens autofocus camera, other component changes

Oct 17, 2011 IHS and Chipworks share details from their preliminary teardowns of the Apple iPhone 4S. The device resembles an iPad/iPhone hybrid, and the 5-lens autofocus camera module is th...

IMAPS: Markovich takes reins, Jones given Lifetime Achievement Award

Oct 14, 2011 At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the reins as the organiz...

IMAPS semiconductor packaging award bestowed on Nordson Asymtek's Adamson

Oct 14, 2011 Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and the microelectronics...

Fraunhofer IZM's packaging center installs Altatech CVD

Oct 11, 2011 All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), with diameters as smal...

Packaging Wire News

NEXX Systems Secures Order From China's Nantong Fujitsu; Deal broadens company's presence in China

Oct 20, 2011 In a move that expands its customer base in China, NEXX Systems shipped a Stratus electrochemical deposition tool to a leading IC manufacturer, Nan...

DDD Group PLC Licensing Agreement

Oct 20, 2011 RNS Number : 5108Q DDD Group PLC 20 October 2011 20 October 2011 DDD Group PLC ViewSonic launches 3D monitor with DDD's TriDef(R) 3D technology Lo...

Northstar Electronics Provides Company Update, Including $6M in Current Contracts

Oct 20, 2011 Northstar Electronics, Inc. (OTCBB:NEIK) is providing a company update to shareholders in regards to active and outstanding business for Q4, 2011 a...


Oct 20, 2011 Samsung Electronics Co. (KSE:005930) and Google Inc. on Wednesday announced a major update to Android software and the new Nexus smartphone after t...

Ozmo Devices Ships One Million Wi-Fi Chips; Highlights Rapid Adoption of Wi-Fi for Peripheral Connectivity

Oct 20, 2011 Ozmo Devices, the leading provider of low-power Wi-Fi Personal Area Network (Wi-Fi PAN) solutions, announced today that it has achieved a key indus...

Four Sanmina-SCI Manufacturing Facilities Receive Highest Level Military Certifications; New Certifications Enable Expanded Partnerships with Defense and Aerospace Customers

Oct 20, 2011 Sanmina-SCI Corporation (Nasdaq: SANM), a leading manufacturing solutions company making some of the world's most complex and valuable electronic a...

OASIS to Define Trust Elevation Standard for Authenticating e-Identity Credentials; Advanced Micro Devices, Axiomatics, Bank of America, BiTKOO, Boeing, Booz Allen Hamilton, CA Technologies, Intel, JPMorgan Chase Bank, New Zealand Government, OIX, Red Hat, SafeNet, Tiani "Spirit", US National Institutes of Health (NIH), US National Institute of Standards and Technology (NIST), US Veterans Health Administration, and Others Work to Ensure Trust in Online Transactions

Oct 20, 2011 The OASIS international open standards consortium has begun work to define a set of standardized protocols that online service providers may use to...

Lockheed to maintain Army aerostats

Oct 20, 2011 The U.S. Army has given Lockheed Martin a $383 million contract to maintain, operate and sustain tethered, aerostat Persistent Threat Detection Sys...

Wire News provided by

Pete's Tweets

    Follow Pete Singer on Twitter

    Advanced Packaging on

    3D Integration & Packaging Blog

    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.

    IFTLE 71: 450mm announcements

    Moving to 450mm has several advantages, the main being that the area is 2.25× larger. This obviously means that more chips can be cut from one wafer, and less material is lost at the edges. The last conversion process... Read More>>


    Advanced Packaging e-Newsletter

    ElectroIQ Blog

    Read opinions/analysis on the day's news, tradeshow updates, and more. We blog about solar, semiconductor, advanced packaging and nanotech manufacturing industries.

    A sad day

    Even if you never met the man personally, you most certainly have benefitted from the inventions that Steve Jobs ushered into existence. The legacy that... Read More>>

    Packaging Videos

    Packaging Financials

    Exclusive Podcast Interviews

    Ziptronix low-temp direct oxide bonding scales pixels to 0.7µm width

    09/27/2011 In a podcast interview with, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the Zipt...

    Sitaram Arkalgud presents SEMATECH packaging survey results

    07/14/2011 Sitaram Arkalgud, director of interconnect at SEMATECH, discusses the high-volume manufacturability issues and gaps in both 2.5D and 3D semiconduct...

    Greg Baker, president and COO of Olympus Integrated Technologies America

    07/11/2011 Greg Baker, president and COO of Olympus Integrated Technologies America, discusses why the company chose to focus its efforts on infrared (IR) met...

    Henkel research scientist speaks on HB-LED packaging

    04/01/2011 Daniel Duffy, Henkel's Advanced Technology Group, speaks on epoxy and silicone encapsulants, what high-brightness LED (HB-LED) manufacturers need f...

    MonolithIC 3D exec talks gate-last, dropping NuPGA

    03/31/2011 Zvi Or-Bach, was interviewed by ElectroIQ about his latest startup, MonolithIC 3D. The costs associated with scaling "up" to 3D ICs are d...