Assembleon launches packaging toolset with low impact force
August 23, 2011
Assembléon is entering the packaging equipment market with the A-Series Hybrid, offering parallel placement technology for system-in-package assembly, multi chip module manufacturing, and flip chip...
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STATS ChipPAC names top suppliers of 2010
August 23, 2011
SATS provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) honored its top materials and equipment suppliers in 2010, recognizing "intense focus and commitment to performance, quality, cycle time, and...
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NATI adds PPMU and SMU test modules to PXI platform
August 22, 2011
National Instruments (Nasdaq: NATI) added per-pin parametric measurement unit modules and source measure unit modules to its PXI platform for semiconductor characterization and production test.
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STATS ChipPAC adds former STM exec to Board
August 22, 2011
Semiconductor packaging and test provider STATS ChipPAC Ltd. (SGX-ST: STATSChP) welcomed Pasquale Pistorio as an advisor to its Board of Directors. |
Compugraphics expanding photomask sizes for WLP
August 19, 2011
Compugraphics International is widening its line of photomasks to include larger-area products up to 16 in2, responding to customer demand for wafer-level packaging and other semiconductor and opti...
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Sporian sensors in development for Gen IV nuclear use
August 19, 2011
Sporian Microsystems received a DOE contract to evaluate harsh-environment materials, MEMS, and packaging technologies for Generation IV nuclear reactor use. |
Multitest test contactor wins out in IDM yield comparison
August 18, 2011
An IDM recently performed side-by-side comparisons of a Multitest Mercury test contactor and an "established contactor of an incumbent Asian competitor" during high-volume production pack...
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Inside the Known Good Die conference
August 17, 2011
The annual Known Good Die (KGD) conference, taking place Nov. 10 in Santa Clara, CA, will address semiconductor die testing, assembly, manufacturing, and business challenges, with the tagline "...;
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Nemotek wafer-level camera integrates CMOS image sensors
August 17, 2011
Nemotek Technologie uncrated the Exiguus, with a VGA wafer-level camera integrating wafer-level optics assembled with CMOS image sensors (CIS). |
MEMS, 3D packaging major factors in iNEMI roadmap
August 16, 2011
The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on MEMS and sensors, and an expanded chapter on packaging to include subs...
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RF power generator suits various silicon fab steps
August 15, 2011
MKS Instruments Inc. (NASDAQ: MKSI) introduced the elite RF Power Generator for RF deposition and etch in a-Si PV, LED, and MEMS manufacturing. |
Johnstech renames Kelvin-ready test contactor
August 15, 2011
Johnstech International Corporation is rereleasing the configurable ROL 200K (Kelvin) Test Contactor as the ROL 200KR Kelvin-Ready Test Contactor for both pad and leaded style devices. |
SEMI hands the reins to Denny McGuirk
August 15, 2011
SEMI appointed Dennis P. McGuirk as president and CEO. He replaces Stanley T. Myers, who is retiring. McGuirk comes to SEMI from IPC -- Association Connecting Electronics Industries, where he led a...
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Tessera adds DARPA former director to board
August 15, 2011
Tessera Technologies appointed Anthony J. Tether, Ph.D., to its board of directors. Tether is CEO of The Sequoia Group, and has held executive positions at DARPA and Ford Aerospace Corp., among oth...
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SEMI convenes system-in-package summit alongside SEMICON Taiwan
August 12, 2011
SEMI will hold the first-ever SiP Global Summit, September 7-9, co-located with SEMICON Taiwan. Three forums cover system in package (SiP) test, the "3D IC era," and the requirements of m...
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