More Packaging Industry News

STATS ChipPAC names top suppliers of 2010

Aug 23, 2011 SATS provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) honored its top materials and equipment suppliers in 2010, recognizing "intense focus and commitment to performance, quality, cycle time, and...

STATS ChipPAC adds former STM exec to Board

Aug 22, 2011

Semiconductor packaging and test provider STATS ChipPAC Ltd. (SGX-ST: STATSChP) welcomed Pasquale Pistorio as an advisor to its Board of Directors.

Multitest test contactor wins out in IDM yield comparison

Aug 18, 2011 An IDM recently performed side-by-side comparisons of a Multitest Mercury test contactor and an "established contactor of an incumbent Asian competitor" during high-volume production pack...

SEMI hands the reins to Denny McGuirk

Aug 15, 2011 SEMI appointed Dennis P. McGuirk as president and CEO. He replaces Stanley T. Myers, who is retiring. McGuirk comes to SEMI from IPC -- Association Connecting Electronics Industries, where he led a...

Tessera adds DARPA former director to board

Aug 15, 2011 Tessera Technologies appointed Anthony J. Tether, Ph.D., to its board of directors. Tether is CEO of The Sequoia Group, and has held executive positions at DARPA and Ford Aerospace Corp., among oth...

Plasma treatment research lab launched in China

Aug 11, 2011 Nordson MARCH and Science College of Donghua University, Shanghai, China launched a joint laboratory for plasma research and education. The college and supplier will share equipment, research proje...

Microbonds wins University of Waterloo support

Aug 10, 2011 The University of Waterloo, Ontario, through the Applied Research and Commercialization Initiative, is supporting several companies researching and developing new products. One company receiving ai...

Nomura divests semiconductor packaging substrate maker shares

Aug 6, 2011

Nomura Principal Finance Co. Ltd., a wholly owned subsidiary of Nomura Holdings Inc., transferred all the shares it owns in Eastern Co. Ltd. to Eastern.

iPad teardown reveals Apple's hardware supremacy

Aug 4, 2011 Apple Inc.'s iPad has thus far thwarted competitive tablets in design efficiency, according to an IHS iSuppli Teardown Analysis of eight tablet models from IHS (NYSE: IHS). Major savings come from ...

DEK licenses stencil system to Great Lakes Engineering

Aug 3, 2011

Great Lakes Engineering will supply DEK's VectorGuard packaging and surface mount assembly stencil system to customers in 32 states and 3 countries.

Agilent, UC Davis found millimeter wave research center

Aug 3, 2011 Agilent and UC Davis established the Davis Millimeter Wave Research Center to develop advanced mm wave and THz systems for radar, sensors, imaging systems, communications and integrated passive dev...

Unisem adds LTX-Credence tester to US test dev center

Aug 1, 2011

SATS provider Unisem purchased a LTX-Credence PAx RF Test System for its Sunnyvale, CA, test development center, joining other recent test/wafer equipment purchases at the site.

2011 semiconductor industry forecast halved at IC Insights

Jul 29, 2011 The global semiconductor industry will grow only 5% in 2011, not 10%, according to updated figures from IC Insights. The 2011 IC market is being forecast down from 10% to 4%. A bright spot? The opt...

TI achieves volume production with stacked clip-bonded QFN

Jul 28, 2011 Texas Instruments has shipped more than 30 million units of its PowerStack packaging technology, a combination of chip stacking and clip bonding that is designed to improve performance and chip den...

EVG expands HQ, hiring 100

Jul 27, 2011 EV Group (EVG), wafer bonding and lithography equipment supplier, began a manufacturing capacity expansion at its Austrian headquarters, adding floorspace, equipment, worker comforts, and a state-o...