Peter Singer, Editor-in-Chief
Alternative energy applications may help drive the power semiconductor market to $45 billion by 2014, according to IHS iSuppli.
Rapid growth in mainstream consumer markets is changing the structure of the MEMS industry from an artisanal to a volume manufacturing business.
SuVolta is tackling the low-power challenge of mobile SoC devices with its PowerShrink platform and undoped, deeply depleted channel (DDC) technology.
In late June 2010, Amkor and TI announced that they had qualified and begun production of the industry's first fine pitch copper pillar flip chip packages—shrinking bump pitch up to 300% compared to then current solder bump flip chip technology.
When multiple MEMS sensors are included in a system, it is necessary to implement sensor fusion algorithms to take advantage of individual sensor capabilities for better overall performance. Jay Esfandyari, Roberto De Nuccio, Gang Xu, STMicroelectronics, Coppell, TX USA
Steve Palosh, Freescale Semiconductor, Austin, TX USA; Geir Eide Mentor Graphics Corp., Wilsonville, OR USA
Lee Smith, Amkor Technology, Chandler, AZ USA
R. Crisp, et al., Tessera, San Jose, CA USA; W. Chang, et al., Powertech Technology Inc., Hsinchu, Taiwan, R.O.C
Lou N. Hutter, Dongbu HiTek, Seoul, S. Korea
Arthur L. Chait, EoPlex, Inc., Redwood City, CA USA
Frank J. Ardezonne, President, End-Effectors, Santa Clara, CA
