Not only are today’s package designers and assemblers faced with the inherent design and functionality challenges associated with smaller device footprints and higher I/O counts, but they must also ensure that proper thermal control is built into advanced electronics packages. In fact, heat management for modern power semiconductor devices such as rectifiers, power transistors, amplifiers and countless other consumer and automotive applications is one of the most pressing issues facing the packaging industry. As these packages marry smaller outlines with higher functions, ensuring efficient thermal management will be key to long-term reliability and performance.

Until now, the undisputable process benefits of die attach films have been limited to laminate‐based packages that didn’t require conductive die attach materials. But, the same dynamics – namely, miniaturization and greater functionality ‐‐ that are driving the laminate device market are also impacting the leadframe segment. Films, which offer added support for processing today’s thin wafers, have traditionally been available only for non‐conductive processes.

Silver sintering is not a new technology. In fact, it has been around for some time. What is new, however, is a groundbreaking material innovation that now allows power device manufacturers to enjoy the benefits of silver (Ag) sintering and do so in high volume without the need for pressure.