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Featured Electronic Manufacturing Articles

Pyrometers improve quality and yield in silicon growth

Certain environmental conditions are required to grow silicon – ironically, these conditions cause many challenges to creating a high-quality, high-yield product.

Nobel Prize awarded to quasicrystals researcher

The Royal Swedish Academy of Sciences awarded this year's Nobel Prize in Chemistry to Dan Shechtman, Technion - Israel Institute of Technology, Haifa, Israel, for the discovery of quasicrystals.

NIST etches MEMS out of diamonds

NIST developed a method to etch diamond crystals, exploiting the cubic nature of diamond crystals. These diamond-etched features could lead to better MEMS devices.

Brookhaven Lab discovers graphene quasiparticles

Brookhaven National Laboratory scientists discovered a new kind of quasiparticles in three-layer graphene sheets. These quasiparticles have mass dependent on their velocity and could be channeled into new spintronics devices.

MEMS product development -- why is it so hard?

Commercializing MEMS can take years and millions of dollars. While the MEMS industry shares some aspects with the larger semiconductor industry, the comparison is not fair in product development. Karen Lightman, MEMS Industry Group and Alissa M. Fitzgerald of A.M. Fitzgerald & Associates explain what makes developing new MEMS devices so hard.


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Minimize Product Line Downtime and Loss with the Latest Micro Focus Process Testing

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New Pressureless, High UPH Silver Sintering Technology Charges Up Power Device Manufacturers

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New Conductive Die Attach Films Extend Advantages to Leadframe Applications

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Chipworks Real Chips Blog

DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.

GLOBALFOUNDRIES Takes a Different Approach to HKMG in AMD’s Llano CPU/GPU

After much anticipation, and with quite a few design wins, AMD's Llano CPU/GPU chip arrived on the scen... Read More >>

Intel Enlarges Process Lead over Their Competition

22-nm Trigate Transistors DiscussedAt a morning session at the Intel Developer Forum Tuesday, Mark Bohr... Read More >>

Test Point Blog

Observations and opinions about semiconductor test, and the factors that drive how test plays a strategic role throughout the semiconductor design and production process.

Patience is More than a Virtue. It’s Hard.

When I wrote earlier blog posts about creating enduring product ideas, I thought about it in general terms.  But when I began thinking about creating products in the semiconductor industry in particular, I realized it takes special, shall we say, fortitude to be a product developer in this s... More Blogs >>

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Insights From Leading Edge Blog

Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.

IFTLE 71: 450mm announcements

Moving to 450mm has several advantages, the main being that the area is 2.25× larger. This obviously means that more chips can be cut from one wafer, and less material is lost at the edges. The last conversion process from 200m... Read More >>

IFTLE 70 Highlights of the Semicon Taiwan Embeddded Substrates Forum

The 2011 Semicon Taiwan Embedded Substrate Forum "Bridging the Last Mile of Heterogeneous Integration" was chaired by Dr. Kuo-Ning Chiang, Professor, Director-Advanced Packaging Research Center, NTHU.One of the main messages f... Read More >>

Solar Specs Blog

Speculations and ruminations on the state of the solar energy industry by the editors of

How Can the U.S. Solar Industry Meet Expectations? Part 3

How Can the U.S. Solar Industry Meet Expectations? Part II

What is

ElectroIQ, the portal for electronics manufacturing, is the home for Solid State Technology (semiconductors), Photovoltaics World (photovoltaics), Advanced Packaging (packaging) and Small Times (nanotech/MEMS). These publications cover manufacturing technology, business news for major companies, trade events, and more.