New Conductive Die Attach Films Extend Advantages to Leadframe Applications
Until now, the undisputable process benefits of die attach films have been limited to laminate‐based packages that didn’t require conductive die attach materials. But, the same dynamics – namely, miniaturization and greater functionality ‐‐ that are driving the laminate device...
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Silver Price Control: New Materials Technology Helps Mitigate Silver’s Rising Cost
With the relentless rise in silver prices over the past couple of years has come a packaging production cost challenge for device manufacturers: how to manage the faster, better, cheaper demands of consumers alongside such a challenging market factor. Silver is a critical meta...
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Achieving Thermal Control for Power Devices: Die Attach Solder Pastes for Varying Requirements
Not only are today’s package designers and assemblers faced with the inherent design and functionality challenges associated with smaller device footprints and higher I/O counts, but they must also ensure that proper thermal control is built into advanced electronics pac...
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The Role of Wafer Bonding in 3D Integration and Packaging
There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), front end of line (FEOL) and other variations of these approaches. This work will explore the role of wafer bo...
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RoHS Means Big Changes for Power Devices. Are you Ready?
While design and assembly of today’s smaller, higher functioning semiconductor devices continues to be challenging, addressing the thermal requirements of modern power packages from a materials point of view is arguably one of the most pressing issues facing this market sector...
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New Die Attach Film Raises the Bar on Wetting and Molding Performance
Complexity, functionality, miniaturization and cost-efficiency have been and continue tobe the mantra of the electronics industry. Arguably, no segment is more keenly aware ofthis fact than the semiconductor packaging sector. As die stacks grow in number and, therefore, wafers...
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New Wafer Backside Coating Innovation Stacks Up Against Film
Consumers continue to drive demand for smaller, thinner and more capable electronicdevices which, then, require integrated packages that can cope with today’s newproduct footprints. For packaging specialists, that means the processing of thinnerwafers and stacking of muc...
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µPILR™ Flip Chip for High-Performance Applications
The ever increasing market requirements for high-performance, high speed, and densely packaged devices with shrinking form factors have propelled the use of flip chip technology in electronic packages. Flip chip packaging becomes an attractive choice due to its high packaging ...
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Cooling Thin Consumer Electronic Devices
Today’s modern electronic devices are more dense and capable than ever before. Cooling these devices is important not only for the reliability and stability of the electronic circuitry, but also for the comfort of the user and the integrity of the display technology.Syst...
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Delivering Optimized High Performance Computing Through Advanced Interconnects
The most important element in the microelectronics performance, be it low power, electrical performance or reliability, is the interconnect from the chip to the package. As the power to drive the signal is reduced to meet thermal performance and extend battery life, the interc...
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