During the Tuesday morning sessions, ConFab attendees heard from speakers from Mentor Graphics, Intel, Infineon Technologies, Quantum Clean, and Edwards.
Dr. Wally Rhines of Mentor Graphics traced the longer term learning curve and the accelerated reduction in the cost per bit to provide a roadmap for new capabilities.
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NanoFocus AG introduces new inspection system for semiconductors industry
Edwards launches new vacuum pumps at SEMICON China 2016
Low-outgassing Faraday Isolators to improve lifetime and reliability of optical systems
Specialized Materials Meet Critical Packaging Needs in MEMS DevicesMicroelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,
Protecting Electronics with ParyleneThis whitepaper provides a comprehensive overview of parylene conformal
coating, advantages of parylene, and applications for parylene to
protect electronic devices.
As technology continues to advance, devices will encounter rugged
environments and it is vital that they are properly protected. Parylene
conformal coating is one way that manufacturers are giving their devices
a higher level of protection, along with increasing the overall quality
of their products.
Parylene conformal coating applications for Electronics include:
· I/O & PCI Modules
· Power Converters and Supplies
· Backplanes
· Other Embedded Computing applications
· Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT
FinFET Transistors Move Scaling to a New Dimension
June 21, 2016 at 1 PM ET / Sponsored by Air Products
Process technology has a symbiotic relationship with hyperconverged infrastructure in datacenters, as each is both enabled and driven by the other. Exponentially increasing data volumes of data centers require huge memory bandwidth and high-speed interconnectivity between servers, storage, and switches, in turn defining and requiring chips with leading-edge process technology.Interconnection Technologies
June 2016 (Date and time TBD)/Sponsored by Air Products
This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.
IFTLE 290 ASE / SPIL: The Struggle Continues; UMD's Pecht Wins IEEE Packaging Field Award
ASMC 2016 Conference Has Highest Attendance Ever, Chipworks Achieves Twelfth Paper
Latest on EUVL Development to be Discussed in EUVL Workshop in Berkeley
Contact Resistance and its Role in Limiting Transistor Performance
Eloquent Executives Ecosystem Expositions
Interconnect Robustness Depends on Scaling for Reliability Analysis
10 Reasons to Attend The ConFab this June
Tech Industry security highlighted by the iPhone access controversy
Check out the finalists for MEMS & Sensors Technology Showcase at MEMS Executive Congress 2015
Transition to ISO 9001:2015: Starting the Journey
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