Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners

December 14, 2011 -- Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch International.

Laminate substrates remain the largest segment of packaging materials: $9.7 billion globally in 2011. This sector will see healthy 8% growth (unit basis) in a 5-year compound annual growth rate (CAGR).

New materials are pushing higher growth in certain areas, including underfill materials, wafer-level dielectrics, copper bonding materials, and leadframe chipscale packaging (CSP), among others.

Key opportunities for growth in the packaging market include 9µm lines and spaces on laminate substrates, warpage-reducing materials for thinned wafers and die, resin materials with low ionic levels for copper wire bonding, encapsulants and mold compounds that reduce wire sweep in high-density packages, no-flow or wafer-applied underfill for flip chips, reworkable underfill, thermally conductive die attach films (DAF), and materials targeting redistribution layers (RDLs) in wafer level packages (WLPs) with higher resolution at thicker layers.

Semiconductor packaging
material segment

Estimate of 2011 global

Laminate substrates


Flex circuit/Tape substrates




Bonding wire


Mold compounds


Underfill materials


Liquid encapsulants


Die attach materials


Solder balls


WLP dielectrics


Thermal interface materials


SEMI and TechSearch International's Global Semiconductor Packaging Materials Outlook: 2011/2012 Edition covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics, and thermal interface materials (TIMs).   

The findings in the report are based on more than 140 indepth interviews conducted with packaging subcontractors, semiconductor manufacturers and materials suppliers. It includes previously unpublished data on revenue, unit shipments and market shares for each packaging material segment; a five-year forecast of revenue and units (2011-2015), average selling price data and trends; and an analysis of regional market trends. The report also identifies important technology and business trends affecting the packaging materials market, as well as opportunities for suppliers. For more information, visit www.semi.org/en/MarketInfo.

SEMI is a global industry association serving the nano- and microelectronics manufacturing supply chains. For more information, visit www.semi.org.

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