Wafer level packaging, MEMS facility lands Canadian grant - Advanced Packaging
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Wafer level packaging, MEMS facility lands Canadian grant

(December 9, 2010) -- The MiQro Innovation Collaborative Centre (MICC; Bromont, QC, Canada) will receive a $14.1 million grant as part of the Canadian government's Centres of Excellence for Commercialization and Research (CECR) program. This new grant, to be paid to the MICC over five years, is in addition to $83 million from the Canadian government and $95 million from the Quebec government announced in 2009.

The investment is part of a $61.1 million program that establishes the MICC as one of five new Centres of Excellence. It is intended to accelerate and increase the MICC's level of contribution to the Canadian and global semiconductor industries. The grant will be used to attract top researchers and add resources at the centre to support the process of translating leading-edge research into practical, commercializable industry solutions.

DALSA (Waterloo, ON, Canada) is one of the founding partners in the MICC along with IBM Canada and the Université de Sherbrooke. The MICC will house equipment for 200mm-based microelectromechanical systems (MEMS) and 3D wafer level packaging (WLP), as well as advanced technologies associated with the assembly and packaging of silicon chips.

For more information, contact DALSA at http://www.dalsa.com/