Nantong Fujitsu Microelectronics installs NEXX tool for copper pillar, RDL packaging

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October 19, 2011 - PRNewswire-Asia -- NEXX Systems shipped a Stratus electrochemical deposition tool to Nantong Fujitsu Microelectronics Co. Ltd. (NFME), based in Jiangsu province, China. NFME will use the Stratus for copper pillar and re-distributed layer (RDL) advanced packaging applications.

The Stratus is a fully automated electrochemical deposition system that deposits thick metal layers. Wafers are processed in a vertical orientation for higher quality results and higher-throughput concurrent processing.

The Nexx tool will help NFME "keep pace with [its] aggressive roadmap," said NFME's president, member of board, Mr. Shilei, adding that the tool will be used to package diverse chips for international customers. NEXX CEO Tom Walsh noted that the Stratus deposition system is well suited to packaging consumer mobile ICs.

The sale into China is a milestone in NEXX's infrastructure and staff expansion in the region, where NEXX added a Shanghai office. NEXX sees China's semiconductor packaging industry shifting to leading-edge packaging technologies, citing Prismark Partners' Brandon Prior, who notes that China is becoming "a key region" for advanced packaging such as wafer-level technologies (WLCSP, FOWLP), through silicon vias (TSV), and copper pillar bumps.

NFME is a technology and market leader that focuses on testing and assembling semiconductors for more than half of the top semiconductor manufacturers. Learn more at

NEXX provides the global semiconductor industry with productive, flexible and efficient deposition technology for advanced packaging applications. Learn more at

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