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Study conducting thin films, metal cylinders, and more with Asylum Research AFM Electrochemistry Cell (Mar 10, 2011)

Asylum Research launched the Electrochemistry Cell (EC Cell) for its MFP-3D AFMs. The EC Cell is a versatile platform for electrochemical experiments combined with AFM imaging, accommodating metal cylinders, flat conducting samples, and even conducting thin films on insulating substrates.

NIST updates materials simulation software (Mar 3, 2011)

Computer scientists at the National Institute of Standards and Technology (NIST) have improved software that can take much of the guesswork out of difficult materials development and environmental simulation problems.

Recession hit semiconductor microscopy hardest, but semi and nanotech are driving recovery (Feb 9, 2011)

GIA released a comprehensive global report on microscopes markets. Scanning-probe and charged particle microscopes were severely hit by the recession, as the microscopes are largely used in semiconductor industry. Going forward, scanning probe microscopes represents the fastest growing product segment in the global microscopes market.

Leica debuts surface imaging and metrology software for industrial microscopy (Feb 1, 2011)

Leica Microsystems and Digital Surf announced an agreement whereby Leica Map surface imaging and metrology software, based on Digital Surf's Mountains Technology, will be used with the Leica Application Suite (LAS) for Leica industrial microscopes.

High-resolution spectrometer offers tailored gratings, high-performance optics (Jan 27, 2011)

McPherson spectrometer McPherson’s high-resolution spectrometer, Model 2061, is now available for scanning and imaging applications via 2D CCD or CMOS detectors. It suits emission, luminescence, Raman (strained Silicon), and high-temperature plasma measurement with better than 0.02nm full width half maximum spectra.

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Solid state Si photomultiplier tech from Excelitas Technologies hits record results (Mar 3, 2011)

Excelitas Technologies, optoelectronics provider, achieved record, world-class performance results for high photon detection efficiency (PDE) and low dark counts in the development and commercialization of its solid state silicon photomultipliers (SiPM) technology.

C3Nano CNT tech brings $3.2M in series-A funding, JVs planned (Feb 18, 2011)

The funding will enable C3Nano to scale up its hybrid carbon nanotube (CNT) based transparent electrode ink and film for use in devices such as touch screens, OLED devices, PV panels and flexible displays and to collaborate with customers.

IBM tops patent list, again, in 2010 (Feb 17, 2011)

IBM said that its inventors received a record 5896 US patents in 2010, marking the 18th consecutive year it has topped the list of the world's most inventive companies, and the first time a company has received >5000 patents in one year in the US.

Graphene patent analysis report published by Displaybank (Feb 16, 2011)

graphene patents. Source: Displaybank February 2011. Displaybank's latest report covers graphene technology patents registered in Korea, U.S., Japan, and Europe by August 20, 2010. Valid patents corresponding to graphene manufacturing and applications are culled from 891 items of raw data.

CVD Equipment books $9.3M in January orders from LED, PV, nanotechnology customers (Feb 16, 2011)

CVD Equipment Corporation (Nasdaq: CVV) announced that new orders received during January 2011 totaled approximately $9.3 million dollars. These orders are for both production and research equipment in the fields of solar, LEDs and nanotechnology.

More Nanotech/MEMS Industry News

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Franklin Kalk, CTO at Toppan Photomasks, lists the lithography options for 22nm-16nm and below (immersion/double patterning, EUV, imprint) and why no option should be closed until a cost-effective solution is available with which everyone can live.; 16nm; 22nm; double patterning; EUV; immersion; imprint; Kalk; Lithography; SEMICON West; Toppan; video; Jeff Welser, head of the SRC's Nanotechnology Research Initiative, talks about the semiconductor industry's need for a new switch to replace the transistor, possible options, and recent funding. ; graphene; nanotechnology; NRI; SEMICON West; SRC; transistor; Jeff Hilbert, president and CEO of WiSpry talks about his company's approach to RF-MEMS with tunable capacitors.; Hilbert; MEMS; RF-MEMS; tunable capacitors; WiSpry; Jean Christophe (J.C.) Eloy, president and CEO of Yole Development, talks about the MEMS market and notable trends. ; Eloy; MEMS; MEMS market; SEMICON West; Yole; Eric Eisenhut, vp of sales and marketing for Kionix, talks about his company's MEMS microsystems including accelerometers, gyroscopes and microfluidics.; Eisenhut; Kionix; MEMS; SEMICON West; Jeff Spiegelman, founder and president of RASIRC, talks about the applications for high purity steam generation in IC and photovoltaics. ; Lithography; photovoltaics; rasirc; SEMICON West; spiegelman; steam; Hans Stork, group VP & CTO at Applied Materials, discusses the progress being made in developing cost-effective 3D/TSV solutions. The company is working in an open architecture environment to ensure complete solutions are ready for end users.; 3d; Applied Materials; SEMICON West; semiconductor; Stork; through-silicon via; TSV; Emmanuel Van Kerschaver, Group Leader, Solar Cell Technology Group at IMEC, highlights recent developments at the research center, including an 18.5%-efficient solar cell with copper-plated contacts, and a chloride-free solar cell texturing process.; IMEC; Kerschaver; photovoltaics; SEMICON West; solar cell; texturing; At SEMICON West, Horacio Mendez, executive director of the SOI Industry Consortium, previewed a major study that compares the manufacturability, performance, and cost of 3D transistors vs. bulk.; 3d; Mendez; SEMICON West; silicon; soi; Matthias Meier, manufacturing engineering & automation at the Fraunhofer Institute, discusses his role as "coach" of the PV Equipment Standards task force.; Fraunhofer; Intersolar; Meier; photovoltaic equipment; PV; SEMICON West; solar; standards; video; SEMI's newly appointed chairman, J.C. Kim of Edwards Korea, talks about the need to revisit the value proposition for SEMICON trade shows, the changing mix of members, and the need to emphasize green initiatives.; edwards; green; Korea; SEMICON West; show; video; Wally Rhines, chairman and CEO of Mentor Graphics, summarizes the key themes from his keynote at SEMICON West: no consolidation, the 65nm-45nm ramps are nothing new, and the industry recovery will beat that of the general economy.; design; Mentor Graphic; Rhines; SEMICON West; semiconductor; IMEC?s Ludo Deferm provides a look behind some major announcements the consortium made at SEMICON West: laser anneal over spike anneal, EUV mask cleaning, RuTa metallization showing promise for 22nm PVD.; 22nm; anneal; deferm; EUV; IMEC; Lithography; pvd; SEMICON West; Silicon Genesis president & CEO Francois Henley showcases the company's 20µm kerf-free foil, which is particularly well-suited to BiPV applications and capable of being made into solar cells with 20% efficiency.; BIPV; Henley; kerf; photovoltaic; SEMICON West; SiGen; Silicon Genesis; solar; wafer; The main theme at this year's NCCAVS Junction Technology Group meeting will be 22nm junction, which many believe this will be the first node to use msec-only annealing (i.e. diffusionless), according to meeting chair John O. Borland.; 16nm; 22nm; 32nm; anneal; Borland; diffusion; Junction; millisecond; SEMICON West; Ric Borges of Synopsys discusses the application of TCAD simulation to multijunction and CPV solar cells.; borges; photovoltaics; PV; SEMICON West; solar; Synopsys; Jeff Hebb of Ultratech discusses extending laser spike annealing to the 22nm node, previewing a talk at the NCCAVS Junction Technology Group meeting held Thursday, July 16 in San Francisco.; anneal; Junction; SEMICON West; Ultratech; video; Paul Siblerud of Semitool discusses 3D integration challenges and announces the latest news from the EMC-3D Consortium.; 3d; packaging; SEMICON West; Semitool; Sibelrud; Jan Vardaman discusses alternatives to 3D/TSV technologies for cost-sensitive applications, and makes the case for additional work to develop design guidelines and software, and test methodologies for 3D/TSV technologies.; 3d; SEMICON West; Techsearch; through-silicon via; TSV; Vardaman; Soitec's president and CEO, André-Jacques Auberton-Hervé, discusses the three pillars of 3D integration at the wafer level, as well as bonding at room temperature.; 3d; SEMICON West; Soitec; wafer bonding; On a cost/Watt basis, thin-film solar PV is potentially very attractive, notes Linx Consulting's Mark Thirsk. If the technical challenges are solved, he's bullish that thin-film may take over a 30% share of the market.; Intersolar; materials; SEMICON West; solar photovoltaics; thin-film; thirsk; SEMATECH's Bryan Rice gives a positive assessment of EUV and offers hope for getting companies to open their checkbooks for mask inspection infrastructure funding.; electronics; equipment; EUV; Lithography; manufacturing; new technology; SEMATECH; SEMICON West; Bill McClean, president of IC Insights, talks about the rebound of the semiconductor industry in 2009, and his expectations of double digit growth in 2010 and 2011.; B.J. Han, chief technology officer of STATS ChipPAC talks about trends in advanced packaging technology. ; Confab; HAN; packaging; STATS ChipPAC; ElectroIQ brings you informative video content from Solid State Technology, Photovoltaics World, Advanced Packaging, Small Times and Surface Mount Technology.