Jamal Izadian, co-founder & president of RFCONNEXT, makes the case for shaped membrane transmission lines (SMTL) for use in high-speed 3D packaging applications. SMTL supports and improves flip-chip, micro-bumping, wafer thinning, system-in-package (SiP), package-on-package (PoP), and other packaging processes by extending the bandwidth and high-speed limits of these technologies.
Agilent Technologies Inc. (NYSE:A) expanded its mixed-signal and digital-storage oscilloscope portfolio with 26 new models that comprise its next-generation InfiniiVision 2000 and 3000 X-Series. Entry-level mixed-signal oscilloscopes and an integrated function generator are part of the 2 new product groups.
STATS ChipPAC launched fcCuBE technology, an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes. STATS ChipPAC claims the flip chip package is cost-comprable to standard packaging processes, and compatible with shrinking semiconductor device nodes down to 28nm.
Dave Rose, Keithley Instruments, addresses specific cabling techniques for DC, multi-frequency capacitance, and ultra-fast I-V and pulse testing, as well as the importance of proper grounding and shielding, choosing the proper interconnect for a specific measurement, and troubleshooting common interconnect problems.
Hitachi Chemical has granted Henkel a worldwide license for the manufacture and sales of certain dicing die attach film.
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Tessera Technologies Inc. (NASDAQ:TSRA) announced that on February 17, 2011, it sent Amkor Technology, Inc. an official notice of termination of their license agreement with Tessera. The two companies are currently in arbitration regarding multiple issues.
inTEST Corporation (NASDAQ: INTT) subsidiaries, Temptronic and Sigma Systems, both in Sharon, MA, will begin operating under the umbrella trade name, inTEST Thermal Solutions Corp.
Camtek Ltd. (Nasdaq:CAMT; TASE:CAMT) received an order for multiple wafer inspection systems from one of the world's largest manufacturers of CMOS image sensors (CIS).
InVisage Technologies, image sensor technology start-up, received its series C round of venture funding, led by Intel Capital. The undisclosed amount will be used to bring the company's quantum-dot-based QuantumFilm technology and products into mass production.
Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.
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The Role of Wafer Bonding in 3D Integration and Packaging
There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), ...
Sponsored By: Suss MicroTec
RoHS Means Big Changes for Power Devices. Are you Ready?
While design and assembly of today’s smaller, higher functioning semiconductor devices continues to be challenging, addressing the thermal requirements of ...
New Die Attach Film Raises the Bar on Wetting and Molding Performance
Complexity, functionality, miniaturization and cost-efficiency have been and continue tobe the mantra of the electronics industry. Arguably, no segment is more keenly ...
New Wafer Backside Coating Innovation Stacks Up Against Film
Consumers continue to drive demand for smaller, thinner and more capable electronicdevices which, then, require integrated packages that can cope with today’s ...
µPILR Flip Chip for High-Performance Applications
The ever increasing market requirements for high-performance, high speed, and densely packaged devices with shrinking form factors have propelled the use of flip ...
Sponsored By: Tessera Technologies, Inc.