Jamal Izadian, co-founder & president of RFCONNEXT, makes the case for shaped membrane transmission lines (SMTL) for use in high-speed 3D packaging applications. SMTL supports and improves flip-chip, micro-bumping, wafer thinning, system-in-package (SiP), package-on-package (PoP), and other packaging processes by extending the bandwidth and high-speed limits of these technologies.

Agilent Technologies Inc. (NYSE:A) expanded its mixed-signal and digital-storage oscilloscope portfolio with 26 new models that comprise its next-generation InfiniiVision 2000 and 3000 X-Series. Entry-level mixed-signal oscilloscopes and an integrated function generator are part of the 2 new product groups.

STATS ChipPAC launched fcCuBE technology, an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes. STATS ChipPAC claims the flip chip package is cost-comprable to standard packaging processes, and compatible with shrinking semiconductor device nodes down to 28nm.

Dave Rose, Keithley Instruments, addresses specific cabling techniques for DC, multi-frequency capacitance, and ultra-fast I-V and pulse testing, as well as the importance of proper grounding and shielding, choosing the proper interconnect for a specific measurement, and troubleshooting common interconnect problems.

Hitachi Chemical has granted Henkel a worldwide license for the manufacture and sales of certain dicing die attach film.

Tessera Technologies Inc. (NASDAQ:TSRA) announced that on February 17, 2011, it sent Amkor Technology, Inc. an official notice of termination of their license agreement with Tessera. The two companies are currently in arbitration regarding multiple issues.

inTEST Corporation (NASDAQ: INTT) subsidiaries, Temptronic and Sigma Systems, both in Sharon, MA, will begin operating under the umbrella trade name, inTEST Thermal Solutions Corp.

Camtek Ltd. (Nasdaq:CAMT; TASE:CAMT) received an order for multiple wafer inspection systems from one of the world's largest manufacturers of CMOS image sensors (CIS).

InVisage Technologies, image sensor technology start-up, received its series C round of venture funding, led by Intel Capital. The undisclosed amount will be used to bring the company's quantum-dot-based QuantumFilm technology and products into mass production.

Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.