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Packaging Videos
B.J. Han, chief technology officer of STATS ChipPAC talks about trends in advanced packaging technology. ; Confab; HAN; packaging; STATS ChipPAC; Jan Vardaman, president, TechSearch International, (Vardaman's presentation was delivered by Smith, due to a flight cancellation caused by the weather) explores thru-silicon vias (TSVs).; Jan Vardaman; packaging; SMTAI; TechSearch International; through-silicon vias; thru-silicon via; TSI; TSV; At SEMICON China, Kulicke & Soffa Industries, Inc. launched two next-generation wire bonders, IConn and ConnX; Dage's Paul Walter, Managing Director, talks to Gail Flower at Semicon West 2008.; packaging Dage Semicon West 2008; Ritwik Chatterjee, Ph.D., speaking on behalf of the Georgia Tech Packaging Research Center (PRC), defines 1st and 2nd level integration through all-silicon interconnection.; all silicon; Georgia Tech; Package in package; Packaging Research Center; Ritwik Chatterjee; Gene Dunn, Panasonic Factory Solutions of America, examines thin-die packaging issues that EMS providers will need to consider in board layout for bend possibilities, pick-and-place systems for picking force, and reflow for overheat concerns. ; board design; Fragile Components; Fragile Packages; Miniaturization; panasonic; pick-and-place; reflow; smt; Thin Die; Sitaram Arkalgud, PhD, Director, Interconnect Division, talks about SEMATECH's emphasis on new technologies.; Advanced Packaging; Confab; Gail Flower; Sitaram Arkalgud; Aviza's Kevin Crofton, VP and General Manager, talks to Gail Flower at Semicon West 2008.; Aviza Crofton Semicon West 2008; Asymtek's Greg Wood, vice president of sales, talks to Gail Flower at Semicon West 2008.; Semicon West 2008 asymtek packaging; Jacques Coderre, Unovis Solutions, presents "Assembly Evolution as Semiconductor and Circuit Board Converge." ; Co-design; convergence; Embedded Components; Flip Chip; packaging; smt; Unovis; Paul Ruo, National Sales Manager for Aries, talks to Gail Flower at Semicon West 2008.; Aries Semicon West 2008 packaging; Lee Smith, VP of business development at outsourcing semiconductor assembly and test (OSAT) provider Amkor Technology, was instrumental in developing the package-on-package (PoP) stack.; AmKor; Lee Smith; package on package stack; Pop; Sats; David Geiger, Flextronics International, explains how EMS assemblers implement new packages in their processes.; Bare Die; ems; Flextronics; new packages; Pop; SATS/EMS; smt; stacked packages; Panasonic's Gene Dunnn, Engineering Manager, talks to Gail Flower at Semicon West 2008.; Panasonic Semicon West packaging; Palomar's president, Bruce Hueners, talks about packaging trends at Semicon West 2008.; Palomar Semicon West 2008 packaging; Vern Solberg, STI ? Madison, speaks on miniaturization, such as wafer-level packaging (WLP) and chip on board (COB).; BGA; Cob; Flip Chip; Miniaturization; smt; Vern Solberg; Wireless Handsets; Lee Smith, Senior Director at Amkor and industry expert in 3-D packaging talks about the latest package styles.; Advanced Packaging; AmKor; Confab; Gail Flower; Lee Smith; Scott Kennedy, senior development engineer at Rogers Corporation, looks at the potential inherent in new package substrates.; ceramic packages; ceramics; Military; packaging; SMTAI; substrates; TSV; Rozalia Beica, 3D interconnect director at Semitool Inc. and representing the EMC3D consortium, expresses integration in packaging.; 3d packaging; packaging; Semitool; SMTAI; TSV; Eric Beyne, Ph.D., scientific director, Advanced Packaging and Interconnect Center, Interconnect, Packaging & Systems Integration at IMEC talks to Gail Flower at Semicon West.; packaging IMEC Beyne Semicon West; One of Amkor's latest package offerings, FusionQuad, protects the package while making interconnects easier for fine pitch connections to the PCB.; advanced package; AmKor; BGA; fine pitch package; FusionQuad; new package style; PCB package; quad flatpack; SATS provider package; Steve Dwyer, VP and General Manager America, talks about EVG?s greatest strengths as a company.; Advanced Packaging; Confab; EVG; Gail Flower; Steve Dwyer; Welcome to the Advanced Packaging Video Library! AP videos give active, up-close looks at products, people and packaging industry events.
Packaging White Papers

Featured White Papers

The Role of Wafer Bonding in 3D Integration and Packaging
There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), ...
Sponsored By:  Suss MicroTec
RoHS Means Big Changes for Power Devices. Are you Ready?
While design and assembly of today’s smaller, higher functioning semiconductor devices continues to be challenging, addressing the thermal requirements of ...
Sponsored By:  Henkel Corporation
New Die Attach Film Raises the Bar on Wetting and Molding Performance
Complexity, functionality, miniaturization and cost-efficiency have been and continue tobe the mantra of the electronics industry. Arguably, no segment is more keenly ...
Sponsored By:  Henkel Corporation
New Wafer Backside Coating Innovation Stacks Up Against Film
Consumers continue to drive demand for smaller, thinner and more capable electronicdevices which, then, require integrated packages that can cope with today’s ...
Sponsored By:  Henkel Corporation
µPILR™ Flip Chip for High-Performance Applications
The ever increasing market requirements for high-performance, high speed, and densely packaged devices with shrinking form factors have propelled the use of flip ...

Recent White Papers

Understanding Low Outgassing Adhesives
Applications that must meet stringent outgassing requirements now have more adhesive options than ever. If you suspect outgassing could potentially pose a problem ...
Sponsored By:  Master Bond, Inc.,