ElectroIQ caught up with Suresh Ramalingam, director of advanced package design and development at Xilinx, at the January MEPTEC luncheon, where he gave a presentation on the company's stacked silicon interconnect technology. In an interview with Debra Vogler, Ramalingam discusses SSIT in relation to die stacking and TSV.
SEMI International is forming a standards committee to evaluate and create specifications and practices for 3D stacked ICs (3DS-IC), with initial efforts targeting three areas: bonded wafers, inspection/metrology, and thin wafer handling.
Di Ma spoke with Debra Vogler, senior technical editor, ElectroIQ, about TSMC's work with silicon interposers, die stacking with through-silicon vias (TSV), and gate-last transistor fab.
In his keynote address at the MEPTEC Semiconductor Packaging Roadmaps conference, Bill Bottoms, chairman of Third Millennium Test Solutions (3MTS), gave attendees a dose of reality as he summarized the predicament facing the industry as it pursues 3D ICs. "Everything becomes more difficult at deep sub-micron," said Bottoms.
Andrew Smith, Ventmark Technology Solutions, presents a 3D die stacking technology to address package miniaturization. Using bare die and vertical interconnect structures, this stacking technology permits the design of ultra-thin, near-CSP solutions without TSVs. Designers lacking custom ICs should look to new chip stacking technology.
inTEST Corporation (NASDAQ: INTT) subsidiaries, Temptronic and Sigma Systems, both in Sharon, MA, will begin operating under the umbrella trade name, inTEST Thermal Solutions Corp.
Camtek Ltd. (Nasdaq:CAMT; TASE:CAMT) received an order for multiple wafer inspection systems from one of the world's largest manufacturers of CMOS image sensors (CIS).
InVisage Technologies, image sensor technology start-up, received its series C round of venture funding, led by Intel Capital. The undisclosed amount will be used to bring the company's quantum-dot-based QuantumFilm technology and products into mass production.
Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.
Amkor Technology Inc. (NASDAQ: AMKR), semiconductor assembly and test services provider, announced financial results for 2010, with net sales of $2.94 billion, net income of $232 million, and earnings per diluted share of $0.91. Amkor is currently planning capital additions of approximately $500 million for 2011.
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The Role of Wafer Bonding in 3D Integration and Packaging
There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), ... Sponsored By:
Suss MicroTec
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RoHS Means Big Changes for Power Devices. Are you Ready?
While design and assembly of today’s smaller, higher functioning semiconductor devices continues to be challenging, addressing the thermal requirements of ... Sponsored By:
Henkel Corporation
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New Die Attach Film Raises the Bar on Wetting and Molding Performance
Complexity, functionality, miniaturization and cost-efficiency have been and continue tobe the mantra of the electronics industry. Arguably, no segment is more keenly ... Sponsored By:
Henkel Corporation
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New Wafer Backside Coating Innovation Stacks Up Against Film
Consumers continue to drive demand for smaller, thinner and more capable electronicdevices which, then, require integrated packages that can cope with today’s ... Sponsored By:
Henkel Corporation
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µPILR™ Flip Chip for High-Performance Applications
The ever increasing market requirements for high-performance, high speed, and densely packaged devices with shrinking form factors have propelled the use of flip ... Sponsored By:
Tessera Technologies, Inc.
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Understanding Low Outgassing Adhesives
Applications that must meet stringent outgassing requirements now have more adhesive options than ever. If you suspect outgassing could potentially pose a problem ... Sponsored By:
Master Bond, Inc.,
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