All the major semiconductor players are embracing 3D integration, says Simon Deleonibus. The CEA-Leti scientist and IEEE Fellow wants to see TSV mature and new technologies develop based on wafer bonding. He speaks with Debra Vogler.
CEA-Leti signed a multiyear agreement with SHINKO ELECTRIC INDUSTRIES CO. LTD. to develop advanced semiconductor packaging technology. They will focus on volume production of silicon interposers.
Arthur W. Zafiropoulo, Ultratech, sees the 20/22nm node as a competition for gate-first and gate-last proponents to discover which will lead the semiconductor industry. Device makers that master TSV chip stacking will be the winners over the course of this decade, he says. This is an online exclusive essay in SST's Forecast for 2011: Back to Reality series.
Laurent Clavelier, head of solar technologies department at Leti, discusses the significance of Leti's IEDM paper #2.6 "Engineered substrates and 3D integration technology based on direct bonding for future More Moore and More than Moore integrated devices" with Debra Vogler, senior technical editor.
inTEST Corporation (NASDAQ: INTT) subsidiaries, Temptronic and Sigma Systems, both in Sharon, MA, will begin operating under the umbrella trade name, inTEST Thermal Solutions Corp.
Camtek Ltd. (Nasdaq:CAMT; TASE:CAMT) received an order for multiple wafer inspection systems from one of the world's largest manufacturers of CMOS image sensors (CIS).
InVisage Technologies, image sensor technology start-up, received its series C round of venture funding, led by Intel Capital. The undisclosed amount will be used to bring the company's quantum-dot-based QuantumFilm technology and products into mass production.
Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.
Amkor Technology Inc. (NASDAQ: AMKR), semiconductor assembly and test services provider, announced financial results for 2010, with net sales of $2.94 billion, net income of $232 million, and earnings per diluted share of $0.91. Amkor is currently planning capital additions of approximately $500 million for 2011.
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The Role of Wafer Bonding in 3D Integration and Packaging
There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), ... Sponsored By:
Suss MicroTec
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RoHS Means Big Changes for Power Devices. Are you Ready?
While design and assembly of today’s smaller, higher functioning semiconductor devices continues to be challenging, addressing the thermal requirements of ... Sponsored By:
Henkel Corporation
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New Die Attach Film Raises the Bar on Wetting and Molding Performance
Complexity, functionality, miniaturization and cost-efficiency have been and continue tobe the mantra of the electronics industry. Arguably, no segment is more keenly ... Sponsored By:
Henkel Corporation
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New Wafer Backside Coating Innovation Stacks Up Against Film
Consumers continue to drive demand for smaller, thinner and more capable electronicdevices which, then, require integrated packages that can cope with today’s ... Sponsored By:
Henkel Corporation
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µPILR™ Flip Chip for High-Performance Applications
The ever increasing market requirements for high-performance, high speed, and densely packaged devices with shrinking form factors have propelled the use of flip ... Sponsored By:
Tessera Technologies, Inc.
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Understanding Low Outgassing Adhesives
Applications that must meet stringent outgassing requirements now have more adhesive options than ever. If you suspect outgassing could potentially pose a problem ... Sponsored By:
Master Bond, Inc.,
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