Advanced Packaging covers IC packaging processes, including 3D integration wafer dicing, die placement, die attach, wire bonding, encapsulation/molding, lead forming, solder bumping, package inspection, package test, laser marking, singulation, packing and shipping.
Through our dedicated web site and e-newsletters, as well through our coverage of advanced packaging topics in the print and digital edition of Solid State Technology magazine, we bring you the latest packaging news, in-depth analysis and authoritative com
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