The trend toward complex semiconductor devices is fueling demand for more advanced wafer probe cards capable of accurately and cost-effectively testing these ICs, says January Kister, Microprobe. Kister examines the variables that impact current carrying capability (CCC) during semiconductor wafer test, and describe an optimal probe design with a composite metal structure.

The Unifire 7900IR provides 3D inspection of wafer-scale packaging features as well as registration for wafer-to-wafer bonding applications for use in advanced wafer scale packaging process control.

Agilent Technologies Inc. (NYSE:A) expanded its mixed-signal and digital-storage oscilloscope portfolio with 26 new models that comprise its next-generation InfiniiVision 2000 and 3000 X-Series. Entry-level mixed-signal oscilloscopes and an integrated function generator are part of the 2 new product groups.

Dave Rose, Keithley Instruments, addresses specific cabling techniques for DC, multi-frequency capacitance, and ultra-fast I-V and pulse testing, as well as the importance of proper grounding and shielding, choosing the proper interconnect for a specific measurement, and troubleshooting common interconnect problems.

Agilent Technologies Inc. (NYSE: A) enhanced the memory depth of its Infiniium oscilloscope lineup. All 30 models now ship with the industry's deepest standard memory and offer the deepest memory options, according to the company.

Cascade Microtech Inc. (NASDAQ: CSCD) and imec entered into a collaborative research partnership for testing and characterization of 3D integrated circuit (IC) test structures. Imec will work closely with Cascade Microtech to develop test methods and methodologies for emerging 3D through silicon via (TSV) structures, and to develop global standards.

As it developed an improved FPGA technology, the NuPGA team discovered a path for practical monolithic 3D ICs. MonolithIC 3D changed its strategy to focus on monolithic 3D IC technology as a pure IP innovator organization.

ALLVIA, through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Sergey Savastiouk, CEO at ALLVIA, will present "Silicon Interposers Enable High Performance Capacitors."

NVIDIA Corporation (NASDAQ: NVDA) has licensed Inter-Chip Connectivity (ICC) technology from SMSC (NASDAQ: SMSC), a leading semiconductor company creating valued connectivity ecosystems.

Multitest received its fifth full purchase order for its InCarrier device transfer system with InStrip test handling system adapted to metal frame-based carriers.