Altera closed the gap on Xilinx considerably in 2010, but Xilinx's competitive 28nm product should enable it to stay at the top of the FPGA market. Start-up Achronix could be the first to reach 22nm because of its Intel connection. The Linley Group's FPGA report, "A Guide to FPGAs," covers competitors within the FPGA space, as well as FPGA adoption in the chip industry.
Tessera Technologies Inc. (Nasdaq:TSRA - News) began two corporate initiatives to expand its technologies in semiconductor microelectronics beyond packaging, and to potentially separate its Imaging & Optics business.
Freescale Semiconductor's Networking and Multimedia Group (NMG) placed a volume order for Verigy's V93000 scalable test platform to use in testing select QorIQ PowerPC communications microprocessors, based on Power Architecture technology.
SiliconBlue Technologies unveiled its mobileFPGA platform device roadmap using TSMC's 40nm low power standard CMOS process. The two distinct families target the two areas where smartphones and other handhelds differentiate.
Thin Film Electronics ASA (Thinfilm) and PARC, a Xerox company, entered the next phase of their co-innovation engagement for printed memory devices. This next phase extends the engagement to prototyping the product for manufacturing readiness.
Sigurd Microelectronics Corporation (Sigurd) will be the first adopter of Multitest's MT2168 pick-and-place test handler in volume production in Taiwan. The SATS provider will use it to test various QFN packages.
Achieving Thermal Control for Power Devices: Die Attach Solder Pastes for Varying Requirements
Not only are today’s package designers and assemblers faced with the inherent design and functionality challenges associated with smaller device footprints ... Sponsored By:
Henkel Corporation
|
The Role of Wafer Bonding in 3D Integration and Packaging
There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), ... Sponsored By:
Suss MicroTec
|
RoHS Means Big Changes for Power Devices. Are you Ready?
While design and assembly of today’s smaller, higher functioning semiconductor devices continues to be challenging, addressing the thermal requirements of ... Sponsored By:
Henkel Corporation
|
New Die Attach Film Raises the Bar on Wetting and Molding Performance
Complexity, functionality, miniaturization and cost-efficiency have been and continue tobe the mantra of the electronics industry. Arguably, no segment is more keenly ... Sponsored By:
Henkel Corporation
|
New Wafer Backside Coating Innovation Stacks Up Against Film
Consumers continue to drive demand for smaller, thinner and more capable electronicdevices which, then, require integrated packages that can cope with today’s ... Sponsored By:
Henkel Corporation
|
Understanding Low Outgassing Adhesives
Applications that must meet stringent outgassing requirements now have more adhesive options than ever. If you suspect outgassing could potentially pose a problem ... Sponsored By:
Master Bond, Inc.,
|