Wafer Processing

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WAFER PROCESSING ARTICLES



EV Group begins construction of new Manufacturing III building

05/02/2018  EV Group today announced that it has started construction work for the next expansion phase of its corporate headquarters.

TowerJazz announces release of advanced 300mm 65nm BCD power management platform

05/02/2018  TowerJazz today announced the release of its 300mm 65nm BCD (Bipolar-CMOS-DMOS) process, the most advanced power management platform for up to 16V operation and 24V maximum voltage.

TI expands lead among top analog suppliers in 2017

05/02/2018  Top 10 suppliers held 59% of analog market last year with ON Semi showing strongest growth.

Global semiconductor sales up 20% year-to-year in Q1

05/01/2018  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $111.1 billion during the first quarter of 2018, an increase of 20 percent compared to the first quarter of 2017.

Annual Washington forum brings top industry priorities to policymakers

05/01/2018  Just as the annual Cherry Blossom festival wraps up, international trade has flowered as a top concern for SEMI members, requiring immediate action as 20 SEMI member executives carried the torch for the industry in recent meetings with lawmakers at the annual SEMI Washington Forum.

Speeding up material discovery

04/30/2018  Algorithm take months, not years, to find material for improved energy conversion.

Jim Keller joins Intel to lead silicon engineering

04/27/2018  Intel today announced that Jim Keller will join Intel as a senior vice president. He will lead the company's silicon engineering, which encompasses system-on-chip (SoC) development and integration.

A powerful laser breakthrough

04/27/2018  Lehigh research team demonstrates terahertz semiconductor laser with record-high output power.

Barbara Humpton named Siemens U.S. CEO

04/26/2018  Siemens Corporation today announced that Barbara Humpton has been appointed CEO for the United States, effective June 1, 2018.

Cell membrane inspires new ultrathin electronic film

04/26/2018  Japanese researchers have developed a new method to build large areas of semiconductive material that is just two molecules thick and a total of 4.4 nanometers tall.

Cheaper and easier way found to make plastic semiconductors

04/25/2018  Cheap, flexible and sustainable plastic semiconductors will soon be a reality thanks to a breakthrough by chemists at the University of Waterloo.

TSMC continues to dominate the worldwide foundry market

04/25/2018  Top eight companies held 88% of global foundry market last year.

North American semiconductor equipment industry posts March 2018 billings

04/25/2018  "March 2018 monthly billings for North American equipment manufacturers remain at robust levels," said Ajit Manocha, president and CEO of SEMI.

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TWITTER


WEBCASTS



Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Enabling EUV and the patterning roadmap

Tuesday, June 5, 2018 at 1:00 p.m. ET

EUV lithography has steadily been gaining momentum in recent years and edges closer and closer to insertion in manufacturing. While considerable progress has been made and the first uses of EUV appear imminent, there remain some difficulties that will challenge the rate and degree to which EUV can be employed. This talk will aim to explore the patterning-related challenges that remain, summarize some of the ongoing efforts to tackle these challenges, and give an outlook towards the future.

Sponsored By:

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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EVENTS



LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com
May 10, 2018 - May 12, 2018
Display Week 2018
Los Angeles, CA
http://www.displayweek.org
May 20, 2018 - May 25, 2018
Design Automation Conference 2018
San Francisco, CA
https://dac.com
June 24, 2018 - June 28, 2018
SEMICON West 2018
San Francisco, CA
http://www.semiconwest.org
July 10, 2018 - July 12, 2018


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