imec advances CMOS beyond silicon to Ge, III-V
December 14, 2011
Marc Heyns, fellow at research consortium imec, discusses the group's work on chip fab materials beyond silicon, namely, Ge and III-V, presented in "Advancing CMOS beyond the silicon roadmap w...
|
imec claims RRAM is smallest based on HfO2
December 14, 2011
During IEDM, imec presented the world’s smallest, fully-functional HfO2-based resistive RAM (RRAM) cell, with an area of less than 10 x 10nm². |
IEEE IITC keynotes to come from Intel, NVIDIA
December 13, 2011
Mike Mayberry, VP and director of components research, Intel Corp. and Billy Dally, VP and chief scientist, NVIDIA will keynote the 15th Annual IEEE IITC, June 2012 in San Jose, CA. |
SuVolta's DDC transistor technology @ IEDM
December 8, 2011
SuVolta Inc., developer of scalable low-power CMOS technologies, revealed its Deeply Depleted Channel (DDC) low-power transistor technology at IEEE's IEDM 2011 this week in Washington DC. |
Printed Electronics 2011: Chips, inks, tissue boxes, and apps in between
December 7, 2011
Techcet's Michael A. Fury spent a day at the recent Printed Electronics/Photovoltaics event, where discussions ranged from past, present, and future applications -- from e-readers, organic LEDs, TF...
|
Surface Cleaning and Preparation
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...
Sponsored by
|
450mm Status Report
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by
|
Innovation in Semiconductor Manufacturing Instrumentation
As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more deman...
Sponsored by
|