A major research institution has placed orders for two Advanced Vacuum plasma processing systems that will provide etch and deposition capabilities to be used in nanoelectronics research and development.
The order by imec, a Belgium-based, global nanoelectronics R&D center, is for two Advanced Vacuum Apex SLR systems. One will be configured with an inductively-coupled plasma (ICP) source, with the other configured for high-density plasma chemical vapor deposition (HDPCVD). Apex SLR® systems incorporate a field-proven, high-density plasma source that was developed by Plasma-Therm, parent company of Advanced Vacuum, for its widely used Shuttlelock® line of plasma tools.
Imec is an internationally renowned research institute that works with global partners on many types of nanoelectronics-based innovation. Imec is headquartered in Belgium and has offices in the Netherlands, Taiwan, USA, China, India, and Japan.
Dr. David Lishan, Director, Technical Marketing for Plasma-Therm, noted that “Plasma-Therm has a long history supporting R&D institutions, and this order continues that tradition. We are pleased that leading R&D organizations rely on Plasma-Therm technology for developing new processes and creating smaller, faster, and more efficient devices.”
“It’s gratifying that these Apex SLR systems were selected by imec’s scientists to help develop industry-relevant technology solutions,” Dr. Lishan said. Recent imec innovations include disposable photonics biosensors, flexible electronics, hyperspectral imaging devices, and 3D device integration (advanced packaging) processes.
Advanced Vacuum’s Apex SLR is a highly versatile, small-footprint plasma processing system. Apex SLR ICP is capable of etching a wide range of materials used in semiconductor devices and nanotechnology, while the Apex SLR HDPCVD enables relatively low-temperature plasma deposition of high-quality thin films. These films can include optical coatings, semiconductor device passivation layers, and other materials used in nanoelectronic fabrication and other applications with limited processing thermal budget.