SEMI European MEMS Summit brings industry leaders to Stuttgart

Leading sensors and actuators companies will present the latest trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September 2016.  Following 2015’s highly successful debut in Milano, the SEMI European MEMS Summit this year moves to Stuttgart. Over 250 attendees, including the industry’s global thought leaders, will discuss challenges, opportunities, and solutions.  A full capacity exhibition with representatives from the full value chain will complement the conference.

The event’s keynote presentations will feature:

  • Bosch Sensortec:  “Smart Connected MEMS Sensors – Enabler for the IoT” by Udo Gomez, CTO
  • STMicroelectronics:  “MEMS Sensors and Actuators – Opportunities and Challenges” by Benedetto Vigna, EVP and GM
  • Qorvo: “BAW and the ‘Edge of Tomorrow’ in Wireless Communication: Innovate, Ramp. Repeat” by Robert Aigner, Senior Director
  • AMKOR: “Sensor in Package – Standard Package Platform for Sensor Fusion and IoT” by Adrian Arcedera, VP

In addition to keynotes, the MEMS Summit’s exceptional speaker line-up includes presentations from ams AG, Bosch, Coventor, Fraunhofer IPMS, GLOBALFOUNDRIES, IHS, Invensas, NXP, Roland Berger, STMicroelectronics, Teledyne DALSA, and Yole Developpement.  The event’s main sessions will address Market and Business, Technology, Internet of Things, Automotive, Consumer, and Wearable Electronics. Promising start-ups Innoluce, USound, Polight and Enerbee will pitch their innovative solutions in a brand new session.

The Summit benefits from strong support from within the industry including Platinum Sponsor Bosch Sensortec; Gold Sponsors ASE Group, STMicroelectronics, and SUSS MicroTec; Silver Sponsors Applied Materials, EV Group, LAM Research, and SPTS. Other sponsors include AMKOR Technology, JSR Micro, Materion, Trymax, and VAT.

For more information and registration, please visit www.semi.org/eu/EuropeanMEMSSummit

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Novel Wafer Analyzer for up to 300mm wafer using high speed Raman Imaging Technology
08/08/2016Nanophoton introduces RAMANdrive - a new Wafer Analyzer - for a wide range of applications at semiconductor market a...
Pfeiffer Vacuum introduces HiPace 2800 turbopump for ion implantation applications
07/06/2016Pfeiffer Vacuum has introduced the HiPace 2800 IT turbopump that is designed for ion implantation applications....
NanoFocus AG introduces new inspection system for semiconductors industry
05/31/2016NanoFocus AG, the developer and manufacturer of optical 3D surface measuring technology, introduces the new measuring system µ...