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Global semiconductor sales increase 13.7% to $468.8B in 2018
02/04/2019Global demand for semiconductors reached a new high in 2018, with annual sales hitting a high-water mark and total units shipped topping 1 t...
A year of transformation and execution: Focus on creating member value
01/22/2019Last year the industry posted another remarkable double-digit revenue growth year. IC shipments eclipsed one trillion units for th...
Semiconductor R&D spending will step up after slowing
02/01/20193D die-stacking technologies, manufacturing barriers, and growing complexities in end-use systems among the technical challenges that are expec...
Gartner reports worldwide PC shipments declined 4.3% in 4Q18 and 1.3% for the year
01/17/2019Worldwide PC shipments totaled 68.6 million units in the fourth quarter of 2018, a 4.3 percent decline from the fourth...
Tech Papers
Upcoming Webcasts
Environment, Safety & Health
Date and time TBDThe semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design,...
Wafer Processing
Date and time TBDAs the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch,...

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Governor Cuomo announces IBM investment to create artificial intelligence hardware center at SUNY Poly Albany campus

02/07/2019  Governor Andrew M. Cuomo today announced that IBM, a long-time anchor tenant at the SUNY Polytechnic Institute campus in Albany, plans to invest over $2 billion to grow its high-tech footprint at the campus and throughout New York State.

First transport measurements reveal intriguing properties of germanene

02/07/2019  Germanene is a 2D material that derives from germanium and is related to graphene. As it is not stable outside the vacuum chambers in which is it produced, no real measurements of its electronic properties have been made. Scientists led by Prof. Justin Ye of the University of Groningen have now managed to produce devices with stable germanene.

STMicroelectronics to acquire majority stake in silicon carbide wafer manufacturer Norstel AB

02/07/2019  STMicroelectronics today announced it has signed an agreement to acquire a majority stake in Swedish silicon carbide (SiC) wafer manufacturer Norstel AB.

Graphcore leverages Mentor DFT solutions to speed time to market for innovative AI acceleration chip

02/06/2019  Mentor, a Siemens business, today announced that artificial intelligence (AI) semiconductor innovator Graphcore (Bristol, U.K.) successfully met its silicon test requirements and achieved rapid test bring-up on its Colossus Intelligence Processing Unit (IPU) by using Mentor's Tessent product family.

CEA-Leti combines integrated optics and holography in novel, lens-free augmented reality technology

02/06/2019  Leti, an institute of CEA-Tech, has developed a novel retinal-projection concept for augmented reality (AR) uses based on a combination of integrated optics and holography.

Physicists take big step in nanolaser design

02/06/2019  Nanolasers have recently emerged as a new class of light sources that have a size of only a few millionths of a meter and unique properties remarkably different from those of macroscopic lasers.

John Chong of Kionix named Chair of MEMS & Sensors Industry Group governing council

02/06/2019  SEMI today announced the appointment of John Chong, vice president of product and business development at MEMS manufacturer Kionix, as Governing Council chair of the SEMI-MEMS & Sensors Industry Group.

MEMS & Sensors Technical Congress highlights automotive market, emerging MEMS technologies

02/06/2019  This year’s MEMS & Sensors Technical Congress(MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an exploration of integration standards.

AIM Photonics announces 300mm silicon photonics multi-project wafer performance

02/05/2019  The American Institute for Manufacturing Integrated Photonics (AIM Photonics) today announced a number of technical updates leading to best-in-class 300mm silicon (Si) photonics-based multi-project wafer (MPW) performance for the Department of Defense-sponsored initiative led by SUNY Polytechnic Institute (SUNY Poly).

Researchers report advances in stretchable semiconductors, integrated electronics

02/05/2019  Researchers from the University of Houston have reported significant advances in stretchable electronics, moving the field closer to commercialization.

CEA-Leti builds prototype of next-generation mid-infrared optical sensors for portable device

02/05/2019  CEA-Leti today announced it has prototyped a next-generation optical chemical sensor using mid-infrared silicon photonics that can be integrated in smartphones and other portable devices.

UC Riverside physicists create exotic electron liquid

02/04/2019  The first production of an electron liquid at room temperature opens the way for new optoelectronic devices and basic physics studies.

Mark Majewski named new intelliFLEX CEO

02/04/2019  Electronics industry veteran succeeds founding CEO Peter Kallai as organization shifts head office from Ottawa to GTA.

SEMI-FlexTech issues 2019 request for proposals to advance flexible electronics ecosystem 

02/04/2019  SEMI-FlexTech, an industry-led, public/private partnership, today issued a Request for Proposals (RFP) for artificial intelligence (AI), Human-Machine Interface (HMI), sensor system and other projects to advance the flexible hybrid electronics (FHE) ecosystem.

KLA-Tencor appoints Victor Peng to Board of Directors

02/01/2019  KLA Corporation today announced the appointment of Victor Peng to its board of directors.

Mobile Semiconductor introduces a new 55nm high density memory compiler especially designed for IoT devices

02/01/2019  Mobile Semiconductor announced a new 55nm HD (High Density) memory compiler targeted at the cost sensitive IoT market.

Laser-fabricated crystals in glass are ferroelectric

02/01/2019  For the first time, a team of researchers has demonstrated that laser-generated crystals confined in glass retain controllable ferroelectric properties, key to creating faster, more efficient optical communication systems.

Broadcom joins Semiconductor Industry Association

01/31/2019  The Semiconductor Industry Association today announced the addition of Broadcom Inc. as an SIA member.

Intel names Robert Swan CEO

01/31/2019  Intel Corporation today announced that its board of directors has named Robert (Bob) Swan as chief executive officer.

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Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

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A.I. Enabled Trace Analytics Simplifies Root Cause Analysis and Eliminates Events That Cause Yield Loss

Traditional root cause analysis in manufacturing uses summary data, which is ineffective in the face of complex issues stemming from subtle defects in a process. Full trace analytics, backed by powerful Artificial Intelligence (A.I.) algorithms, uses the entirety of all the sensor and tool data available in a production line for analysis, enabling fabrication engineers to quickly and accurately focus on the causes of issues that negatively affect yield, large and small.February 07, 2019
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Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
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Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
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WEBCASTS

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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EVENTS

SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
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February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


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NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...