RECOMMENDED TECHNOLOGY PAPERS
A.I. Enabled Trace Analytics Simplifies Root Cause Analysis and Eliminates Events That Cause Yield Loss
Traditional root cause analysis in manufacturing uses summary data, which is ineffective in the face of complex issues stemming from subtle defects in a process. Full trace analytics, backed by powerful Artificial Intelligence (A.I.) algorithms, uses the entirety of all the sensor and tool data available in a production line for analysis, enabling fabrication engineers to quickly and accurately focus on the causes of issues that negatively affect yield, large and small.February 07, 2019
Sponsored by BISTel
Keysight's Parametric Measurement Handbook (Rev 4)
Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies
Jumpstart Your Reliability Verification with Foundry-Supported Rule DecksMore Technology Papers
For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics
Environment, Safety & Health
Date and time TBD
The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
Date and time TBD
As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.