MEMS New Product Development: The importance of product validation

Jul 31, 2013 Product validation is an essential part of all successful MEMS new product developments. It is the process of testing products under various environmental, m...

Driven by Apple and Samsung, light sensors achieve double-digit revenue growth

Jul 30, 2013 Light and proximity sensors in mobile handsets and tablets are set for expansive double-digit growth within a five-year period, thanks to increasing usage by...

MediaTek introduces tablet SoC

Jul 29, 2013 MediaTek Inc., a  fabless semiconductor company for wireless communications and digital multimedia solutions, today announced its breakthrough MT8135 sy...

New NIST nanoscale indenter takes novel approach to measuring surface properties

Jul 25, 2013 Researchers from the National Institute of Standards and Technology (NIST) and the University of North Carolina have demonstrated a new design for an instrum...

Micralyne and Adament to develop MEMS-based fiber-optic subsystems

Jul 24, 2013

Companies announce alliance to bring high-performance sensors to market.


ST unveils new pressure sensor technology

GENEVA, SWITZERLAND: STMicroelectronics has announced a new, ST-patented technology that isolates the pressure-sensing element within a fully molded package ...

Germany : SCHOTT offers wide product portfolio of glass wafers for semiconductor industry

-SCHOTT offers wide product portfolio of glass wafers for semiconductor industry

ENP Newswire - 05 July 2013Release date- 04072013 - Mainz (Germany) & Tokyo (Japan) - The international technology company SCHOTT with its business unit ...

Melexis Introduces Next Generation Triaxis® Position Sensor with SAE J2716 SENT Protocol for Safety Critical Applications

Tessenderlo, Belgium – The SAE J2716 SENT (Single Edge Nibble Transmission) protocol serves safety critical, cost sensitive applications in the aut...



MEMS Need Comprehensive, Market-Ready Solutions

Microelectromechanical systems -- commonly known as MEMS -- applications are on the rise. In fact, the MEMS market is currently outpacing overall I...
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Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner...
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Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process s...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business developme...
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Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more demanding of al...
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