Packaging technology is driven by a combination of cost, performance, form factor and reliability. This webcast will examine new advances in conventional back-end packaging, including wafer bumping and copper wire bonding, as well as the role of new 2.5D and 3D integration. Presenters will focus on isssues related to cost, performance (speed, power and noise immunity), form factor (thickness, weight, PCB area consumption), and testability, as well as the tradeoff of technical maturity versus risk in high-volume manufacturing.
The webcast will also include new information on the Hybrid Memory Cube, a three-dimensional structure with a logic device at its base and a plurality of DRAMs vertically stacked above it using through-silicon via (TSV) connections.
This webcast will also be available on iPads, tablets and other mobile devices.
Register here: https://event.webcasts.com/starthere.jsp?ei=1021830
Dr. Iyer oversees a global team that drives a process to determine the packaging design and technologies that best meet the requirements of our customers in measures of miniaturization, performance cycle time, and cost. Dr. Iyer joined TI in 2008 to lead the global SC Packaging team. He has more than 25 years of experience in the microelectronics industry. Dr. Iyer is a recognized authority in semiconductor packaging technologies. He has more than 150 technical publications and 28 patents to his credit.
Aron Lunde is a Product Program Manager for Micron’s Hybrid Memory Cube. His responsibilities include coordinating Micron’s internal departments to develop, construct, and deliver the HMC to meet the demands of multiple business engagements. Mr. Lunde joined Micron in 1994 and worked as a Test Engineer for Micron’s Boise, Lehi and Singapore facilities. He later worked as a Mobile DRAM Designer, implementing repair and test modes on original Micron designs, integrating repair schemes into DRAM and mobile device architectures, and developing tools to evaluate the efficiency of repair schemes. Mr. Lunde has a BS in Electrical Engineering from the University of Idaho and has issued 15 patents.