Wet Processing

July 2014 (date and time TBD)

Wet processing including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions.

Sponsored By

l_Dynaloy_300

 

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....
Radiant Zemax announces ProMetric Y series compact imaging photometers
06/18/2014Radiant Zemax, a provider of light and color test and measurement systems, announces the release of the ProMetric Y line of imagin...
Chad Industries will demonstrate world-class flexible automated wafer handling for 450mm wafers at SEMICON West 2014
06/12/2014Chad Industries, owned by Jabil Circuit, Inc., announced today that it will demonstr...