Date: September 2014 (Date and time TBD)
Free to attend
Length: Approximately one hour
Speakers: To be announced
Registration will be available soon. Click here to pre-register.
Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.
Sponsored by Zeta Instruments
Zeta Instruments designs and builds 3D Optical Profilers and Defect Inspection Systems for a variety of industries and applications.