Reno Sub-Systems closes first venture round with Intel Capital, Innovacorp and other investors

Reno Sub-Systems (Reno) today announced that it has closed its first venture funding round with Intel Capital, early stage Canadian venture capital organization Innovacorp and other investors. Support from these investors will help Reno’s efforts to bring innovative technologies to market and enable next generation advanced semiconductor manufacturing process technology nodes.

Reno designs, develops and delivers sub-systems used to control process systems made by Original Equipment Manufacturers (OEMs), including vacuum-based chambers to deposit and etch specialty materials needed in advanced integrated circuit (IC) fabrication. Reno’s initial sub-system offerings provide RF-power generation and matching, process gas delivery and high- vacuum process control that radically changes the processing speed, range, development and total cost of ownership.

“Reno impresses us as a young company working to advance Moore’s Law,” said Bob Bruck, Vice President and General Manager of Global Supply Management at Intel. “We are pleased to support their efforts to develop innovative solutions for semiconductor capital equipment sub-systems.” Intel Capital’s investment was led by Director Sean Doyle.

“Demand for integrated circuits continues to grow exponentially. Reno has developed evolutionary technologies that allow semiconductor manufacturers to fulfill market demand – faster and at a lower cost than the competition,” said Gregory Phipps, managing director of investment at Innovacorp. “Innovacorp is excited to join Intel Capital in supporting Reno and its growth and commercialization objectives.”

“We are very grateful that our investors understand and support our vision to create radically better solutions to address the manufacturing challenges facing the global micro-electronics industry,”


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