Metrology

Date: November 2015 (Date and time TBD)

Free to attend

Length: Approximately one hour

Registration will be available soon. Please click here to pre-register.

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Interested in sponsoring this webcast? Contact Sabrina Straub.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

One thought on “Metrology

  1. Carlos Strocchia-Rivera

    I would like to remind all metrology engineers about this statement from the ITRS 2005:

    The Metrology roadmap has repeated the call for a proactive research, development, and supplier base for many years. The relationship between metrology and process technology development needs fundamental restructuring. In the past the challenge has been to develop metrology ahead of target process technology. Today we face major uncertainty from unresolved choices of fundamentally new materials and radically different device designs. Understanding the interaction between metrology data and information and optimum feed back, feed forward, and real-time process control are key to restructuring the relationship between metrology and process technology.

    Ten years on and the song remains the same.

    In my opinion, everyone wants the other guy to take big risks, put up the money, and do all the hard work. Worse, willingness to cooperate seems limited.

    We are getting new capabilities in metrology, but as the ITRS 2005 notes, understanding the interaction between metrology data and information and optimum feed back, feed forward, and real-time process control are key to restructuring the relationship between metrology and process technology. These are not “sexy” breakthroughs. These are collaborative efforts aimed at enabling high volume manufacturing at increasingly difficult technology nodes.

    Reply

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Greenpeak and Dusan Launch Smart Parking system
09/14/2015GreenPeak Technologies and Dusun Electron Ltd recently announced a partnership with the launch of their first Smart City assisted parking application tha...
Greenpeak and Dusan Launch Smart Parking system
09/14/2015GreenPeak Technologies and Dusun Electron Ltd recently announced a partnership with the launch of their first Smart City assisted parking application tha...
Entegris expands CMP filtration technology solutions and research, analytical and manufacturing capabilities
09/04/2015The Entegris filter platform using NMB media now includes the Planargard bulk, Solaris point...