Wafer Processing

Date: November 2015 (Date and time TBD)

Free to attend

Length: Approximately one hour

Registration will be available soon. Please click here to pre-register.

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D SRAMs, high mobility transistors and 450mm wafer processing.

Interested in sponsoring this webcast? Contact Sabrina Straub.

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