Date: November 2015 (Date and time TBD)
Free to attend
Length: Approximately one hour
Registration will be available soon. Please click here to pre-register.
As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D SRAMs, high mobility transistors and 450mm wafer processing.
Interested in sponsoring this webcast? Contact Sabrina Straub.