3D NAND Challenges and Opportunities

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Date: December 2015 (Date and time TBD)

Free to attend

Length: Approximately one hour

Registration will be available soon. Please click here to pre-register.

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography. Imec’s Jan Van Houdt, director flash memory program / manager memory device design group, will discuss trends, challenges and opportunities.

Sponsored by Air Products

Air Products has been a leading global supplier of high-purity gases, chemicals, and delivery systems to the electronics industry for over 40 years. We serve all major segments of the industry with a unique combination of offerings, experience, and commitment.  We’re advancing materials science. We’re advancing semiconductors. We’re advancing mobility. What can we help you advance?  www.airproducts.com/advancing

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