ASML ships new TWINSCAN NXT immersion lithography platform

ASML Holding NV (ASML) today announced the first shipment of its new TWINSCAN (TM) NXT:1980Di immersion lithography system to support increasingly demanding multiple-patterning performance requirements. Demonstrating 1.2 nanometer (nm) dedicated chuck overlay and better than 10 nm focus uniformity, the NXT:1980Di features new grid calibrations and hardware that enables chipmakers to achieve tighter process windows for next-generation process nodes. The NXT:1980Di also improves throughput by 10% to 275 wafers per hour.

ASML_Twinscan_NXT_1980Di_Left_Open_print_37731“Whether our customers face increased process complexity due to multiple patterning or plan to add Extreme Ultraviolet lithography, an improved level of immersion patterning is required in all leading-edge semiconductor manufacturing environments,” Bert Koek, Senior Vice President of DUV Product Marketing at ASML said. “The NXT:1980Di is a major leap forward in overlay, focus control and productivity, providing a cost-effective solution for chipmakers to further extend immersion lithography, and ultimately Moore’s Law.”

In future nodes, chipmakers are expected to use both immersion lithography and next-generation Extreme Ultraviolet (EUV) lithography, creating additional overlay requirements beyond the standard node-to-node improvements. The NXT:1980Di is specifically designed to accommodate the mix-and-match use with EUV, achieving about 2 nm matched-machine overlay.

The NXT:1980Di is currently available to customers. All TWINSCAN NXT:1970Ci systems can be upgraded in the field to the performance level of an NXT:1980Di. ASML also provides an upgrade path for previous TWINSCAN NXT models to further extend chipmakers’ capital investment. Additionally, as part of a rich portfolio of upgrade options, ASML offers add-on capabilities with the NXT:1980Di to address unique application needs, like a contrast enhancing alignment sensor to further improve overlay.

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