IDT appoints semiconductor veteran Robert A. Rango to Board of Directors

Integrated Device Technology, Inc. today announced that Robert A. Rango, a former Broadcom Corp. executive with extensive leadership skills in the global semiconductor market, has been appointed to IDT’s Board of Directors, effective April 6, 2015.

“Bob brings significant operating and leadership skills and has successfully run businesses in the mobile, wireless and network infrastructure segment,” said IDT Board Chairman John Schofield. “His executive experience in the global semiconductor industry is invaluable, and we are looking forward to Bob’s contributions as a member of our Board.”

“As anyone following IDT closely knows, this is an exciting time to join the company,” Rango said. “I look forward to working with my fellow board members in supporting IDT’s executive team as it works hard to deliver strong financial results and leading technology to its investors and customers.”

Rango joined Broadcom in March 2002 and served in executive roles for over 12 years, most recently as executive vice president and general manager of Broadcom’s Mobile and Wireless Group, a role he had held since February 2011. During his time at Broadcom, Rango held several senior management positions in the company’s Network Infrastructure Business Unit, Mobile and Wireless Group and Wireless Connectivity Group, including as senior vice president and general manager, Wireless Connectivity Group and as executive vice president and general manager, Wireless Connectivity Group. From 1995 to 2002, Rango held several senior management positions at Lucent Microelectronics and Agere Systems.

Rango also serves on the Board of Directors at KLA-Tencor. He has an MEEE from Cornell University and a BSEE from State University of New York at Stony Brook.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>



Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...
MKS introduces the Cirrus 3-XD Atmospheric gas analysis system
03/10/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirru...