Amkor Technology Inc. (Nasdaq: AMKR), a semiconductor packaging and test service provider, this week announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications.
“Reaching this milestone affirms our leadership role in advanced SiP technologies,” said Steve Kelley, CEO and President of Amkor Technology Inc. “Our broad technology portfolio and engineering talent make Amkor an excellent choice for customers seeking high-performance, miniaturized solutions. In addition to building today’s laminate-based SiPs, we are also developing wafer-level SiP technology to enable the next generation of thinner, higher-performance electronic products.”
An advanced SiP module is composed of multiple semiconductor components with different functionalities which are combined into a single integrated circuit (“IC”) package. Advanced SiPs allow designers to squeeze more functionality into a smaller space, while increasing system performance and lowering system power consumption. Advanced SiPs use a variety of interconnect technologies including wire-bond, flip chip, copper pillars and through silicon vias (TSVs).
Amkor’s laminate-based SiPs are manufactured in high volumes and have fast cycle-time, making them very cost-effective. The company’s wafer-based Silicon Wafer Integrated Fan-out (SWIFT™) and Silicon-less Integrated Module (SLIM™) technologies provide thinner packages at finer line/space geometries and higher densities than laminate-based SiPs. Both SWIFT and SLIM offer a lower-cost alternative to TSV-based 2.5D and 3D packaging.