ALLVIA launches new product lines for Through Glass Vias and Through Quartz Vias

Leveraging significant presence in TSV markets, ALLVIA, Inc. has expanded its capacity into glass and quartz via manufacturing to accommodate customer requests in via-fill technology from silicon interposers to glass and quartz interposers. This will enable next-generation semiconductor 2D and 2.5 D packaging solutions using ultra-thin glass and quartz.

ALLVIA will manufacture ultra-thin glass and quartz interposers using its facility fully equipped for high volume manufacturing of TSV interposers to commercialize the widespread use of interposers. The company will expand its intellectual property from silicon to glass in hole drilling and filling methodologies to fabricate its interposers.

ALLVIA will apply its proprietary technology to fill the high-aspect-ratio via holes with copper plating. ALLVIA’s processes and its production line can produce all types of interposers to achieve the next generation in high-density semiconductor packaging. These 2D and 2.5D interposers are needed to form the electrical connections between a silicon chip and PCBs.

Sergey Savastiouk, CEO, commented:  “Our expansion allows us to solve two problems. First, ALLVIA becomes more flexible with customer requests and, second, ALLVIA can produce more wafers with better quality using state-of-the-art for copper plating, chemical mechanical polishing, deep via thin film deposition.”


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>



NanoFocus AG introduces new inspection system for semiconductors industry
05/31/2016NanoFocus AG, the developer and manufacturer of optical 3D surface measuring technology, introduces the new measuring system µ...
Edwards launches new vacuum pumps at SEMICON China 2016
03/15/2016Edwards announced the availability of two new vacuum pump product families at SEMICON China: the iXM Series for semiconductor etch and chemical v...
Low-outgassing Faraday Isolators to improve lifetime and reliability of optical systems
02/18/2016Qioptiq, an Excelitas Technologies company introduces the LINOS Low-outgassing Faraday Isolators, the first of th...