PACKAGING BLOGS

Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.

INSIGHTS FROM LEADING EDGE

PhilG100x100

Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.

 

IFTLE 154 ICEP part 2: Thinning Effects on DRAM memory retention and More

Thu Jul 11 15:51:00 CDT 2013
Continuing our look at the Osaka ICEP conference held in April 2013. ASET and Tohoku UnivASET and Tohoku Univ reported on the effects of thinning on DRAM and CMOS device characteristics. Basically the thinner the chip becomes, the more likely i... Read More >>

IFTLE 153 IMAPS DPC part 3 Leti, Dow, STATSChipPAC

Wed Jul 03 16:25:00 CDT 2013
Finishing up our look at the 2013 IMAPS Device Packaging ConferenceLetiLeti examined the reliability of die to wafer bonding using copper/tin interconnects.  Above 232 C tin rapidly reacts with copper to produce higher melting point interme... Read More >>

IFTLE 152 2013 IMAPS Device Packaging Conference part 2

Sat Jun 22 16:04:00 CDT 2013
Continuing with our coverage of the March IMAPS DPC. TI In his keynote presentation on semiconductor packaging trends Devan Iyer of TI showed  a great chart on package shrinkage through the years. We have moved from the 1.75mm SOIC to the p... Read More >>

CHIPWORKS

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DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.

A Dispatch from SEMICON West – Applied Materials Launches Epi System Focused on NMOS Strain

Thu Jul 11 13:22:00 CDT 2013
Flying in to SFO on July 7, I must have been one of many attendees delayed by the after-effects of the Asiana Airlines crash there the day before. In my case it was only an hour or so (i.e. as normal), but we couldn’t avoid seeing the remains of the aircraft as we landed. Despite the fact t... Read More >>

Economy Threatens Semi Growth, not Technology – so Say Fab Engineers at ASMC

Thu Jun 06 15:07:00 CDT 2013
It’s still spring in the north-eastern part of North America, and that means it’s the time of year for the Advanced Semiconductor Manufacturing Conference, in the amiable ambiance of Saratoga Springs, New York. The conference took place last month, on May 13 – 16.As the name say... Read More >>

Intel Foundries MEMS for Fuel Cell Start-up Nectar

Wed Jan 30 14:40:00 CST 2013
In the last couple of years there have been announcements that Intel will be acting as a foundry for FPGA company Achronix, PLD maker Tabula and programmable network processor provider Netronome, as well as much speculation about making chips for Apple. All these reports refer to using Intel&rsqu...; Read More >>

PETE'S POSTS

Pete100x100_2

Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.

Key trends at Semicon West 2014

Thu Jul 18 15:17:00 CDT 2013
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Key trends at Semicon West 2013

Thu Jul 18 15:17:00 CDT 2013
At Semicon West last week (and at The ConFab a few weeks ago) some key trends were clearly evident in the semiconductor industry. It’s apparent that the world’s appetite for electronics has never been greater. That has increasingly taken the form of mobile electronics, including ... Read More >>

Tackling Design for Yield Questions at DAC

Wed May 22 15:39:00 CDT 2013
Process variations are unavoidable, but how can chip designers plan for them in their designs to obtain optimal yield and device performance? That’s one of the focal points of a pavilion panel at the upcoming Design Automation Conference (DAC), to be held June 2-6 in Austin, TX. Titled "Le... Read More >>

Join The ConFab discussion

Tue Feb 26 11:27:00 CST 2013
The ConFab is Solid State Technology's annual conference and networking event. This year, it will be held June 23-26 at The Encore at The Wynn in Las Vegas. We recently started a LinkedIn group, where we will inform members of new activities, and keep the discussion going on topics related to sem... Read More >>

Questions and answers on FD-SOI

Fri Jan 04 14:56:00 CST 2013
A month or so ago, we implemented (without much fanfare) the ability to comment and rank articles on this site, and more easily use social media tools. I’d like to call your attention to one interesting exchange, and also invite you to start posting comments of your own. In mid-December, we... Read More >>

Present your ideas at The ConFab in 2013

Mon Nov 26 09:04:00 CST 2012
The ConFab is now accepting abstract submissions for our 2013 conference, to be held June 23-26 in Las Vegas. If you’re an executive at a leading semiconductor manufacturer and would like to present at The ConFab and participate in three days of productive meetings and roundtable discussion... Read More >>
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