RECOMMENDED TECHNOLOGY PAPERS
Versatile Epoxy Compounds for Electronic ApplicationsMore Technology Papers
Electronic systems have revolutionized our lives. We use
them in nearly all of our daily activities, for communication,
computing, navigation, entertainment, payment processing,
and more. They are the workhorses in many medical,
transportation, aerospace, and military systems, performing
functions such as automated control, data analysis, and
pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,
3D Integration and Advanced Packaging Innovation
March 27 at 2:00 p.m. ET 2.5/3D integration and advanced packaging enable better chip performance in a smaller form factor, meeting the needs of smartphones, tablets, and other advanced devices. However, 2.5/3D packaging creates a new set of manufacturing challenges, such as the need to fabricate copper pillars, TSVs, wafer bumping and redistribution layers – which may involve thicker photoresists, spin-on dielectrics and BCB coatings -- and processing may be done on panels instead of round wafers. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.
Multiphysics Modeling of MEMS Devices
April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.
Materials for Semiconductor Manufacturing
Dec 18 at 1 p.m. EST. Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.