MAGAZINE SEMICONDUCTORS BLOGS |
LITHOGRAPHY ARTICLES
|
HEADLINESUSPTO ISSUES TRADEMARK: EESIP
August 27, 2014 -Cypress and HLMC Demonstrate Working Silicon Cells Leveraging 55-Nanometer Embedded Flash IP August 27, 2014 Murata to Buy Peregrine Semiconductor August 27, 2014 KLA-Tencor Introduces Key Systems for 5D(TM) Patterning Control Solution; Accelerating The Ramp Of Advanced Patterning Techniques For Sub-20nm Design Nodes August 26, 2014 Vitesse Adds William C. Martin to Board of Directors August 26, 2014 Eyelit Inc. Releases a New Recipe Management System (RMS) Module to Improve Quality and Lower Manufacturing Costs; Eyelit Manufacturing RMS(TM) coordinates dynamic equipment recipes for automation and advanced process control (APC) August 26, 2014 Renesas Electronics Introduces an IEC 61508 TÜV-CertifiedRX631, 63N Safety Packageto Accelerate Implementation of Safety Systems for Industrial Equipment August 26, 2014 MaxLinear MxL267 Full-Spectrum CaptureTM Receiver Powers AVM's EuroDOCSIS® 3.0 Cable Gateway Family; AVM's FRITZ!Box6490 Cable Gateway Achieves EuroDOCSIS 3.0 Certification with Design Based on MxL267 24-Channel Digital Cable Front End August 26, 2014 FAIRCHILD CLOSING PENANG PLANT August 26, 2014 Toshiba's Discrete Semiconductor Products Strategy August 26, 2014 |
FINANCIALS |
|
TECHNOLOGY PAPERSParylene 101: Learn about the best protection for MEMS This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment.
May 22, 2014 Conformal Coatings for Reliable Electronic AssembliesModern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014 The Next Step in Diagnosis Resolution ImprovementRoot Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014 |
WEBCASTSMetrologySeptember 2014 (date and time TBD) Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.
Sponsored By:
Advanced PackagingSept. 2014 (Date and time TBD) Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.
Sponsored By:
InterconnectsOct. 2014 (Date and time TBD) This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.
Sponsored By:
|
|
VIDEOS |
||
EVENTSMEMS Industry Group Conference - Shanghai 2014Shanghai http://shanghai.memsindustrygroup.org September 11, 2014 - September 12, 2014 Vietnam Semiconductor Strategy SummitHo Chi Minh City, Vietnam http://www.semi.org/en/node/46001 September 16, 2014 - September 17, 2014 SPIE Photomask Technology 2014Monterey, CA http://spie.org/photomask.xml?WT.mc_id=RCal-PMW September 16, 2014 - September 18, 2014 Photomask Technology Exhibition 2014Monterey, CA http://spie.org/photomask.xml?WT.mc_id=RCal-PMW September 16, 2014 - September 17, 2014 APC (Advanced Process Control) Conference XXVI 2014Ann Arbor, Michigan http://www.apcconference.com/ September 29, 2014 - October 01, 2014 |
||