The Confab Visions

Advanced Packaging to be Highlighted at The ConFab

By Dave Mount

There have been a lot of changes in the semiconductor industry in the last few years. One of these changes has been the shrinking number of IC fabricators, which has been driven by mergers and acquisitions and general attrition. Another is that Moore’s Law has seemingly run out of gas due to delays in the development of EUV lithographic techniques, and the quantum effects manifested in the materials used in the low-nanoscale. Seemingly, the ‘work-around’ used to get past the end of Moore’s Law has been in the chip package.

Packaging has become the hottest topic in semiconductor technology. Presently there is a tremendous body of work being done in both Wafer-level packaging (WLP) and Panel-level packaging (PLP). “Smart” systems are all the rage in advanced packaging where the heterogeneous integration of chips in the same package is increasing becoming commonplace.

Partially being driven by the rapidly developing Internet of Things (IoT) connectivity market, The ConFab will devote a large block of time to advanced packaging. Through talks given by Industry recognized speakers, and interactive panels the important topics of: fan-out/fan-in, wafer-level /panel-level, 2.5D/3D, glass/PCB, and materials/manufacturing technologies will be covered during The ConFab.

By expanding The ConFab to include several of the other related materials and manufacturing technologies, such as MEMS, and others, we will be able to cover much larger areas of interest involving advanced packaging. Since this is such an important topic, we will also include packaging market financial metrics and forecasts. There, of course will be other topical areas covered at The ConFab, but we feel that the Advanced Packaging session alone is reason to sponsor or attend The ConFab.


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