Intel stands firm on 450mm; challenged by defects at 14nm
October 17, 2013
IFTLE 165 Semicon Taiwan contd: DRAM Consolidation, Smartphone Mkt; Packaging Materials Forecast
October 16, 2013
Apple A7 uses Samsung’s 28nm process
September 21, 2013
NEWS ANALYSIS & FEATURES
TV semiconductor market growing despite decline in TV shipments
10/18/2013 Wireless video, network interfaces, multi-format decoders, LED backlighting boost average semiconductor content per TV.
Jury finds Qualcomm guilty of patent infringement
10/17/2013 ParkerVision, Inc., a developer and marketer of semiconductor technology solutions for wireless applications, today announced that a jury in the U.S. District Court for the Middle District of Florida found Qualcomm Incorporated guilty of direct and indirect infringement of ParkerVision patents.
MEMS Technology Showcase finalists highlight “MEMS Inside the Machine”
10/17/2013 MEMS Technology Showcase will give MEMS Executive Congress US attendees an intimate look at some of the most unique and inspiring MEMS-enabled applications in the business. After a competitive application process, MEMS Industry Group (MIG) has selected five finalists that show how MEMS enhances the consumer experience, highlighting the “MEMS inside the machine.”
Next Generation Metrology and Inspection
10/17/2013 Nov 7 at 3 PM ET. Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.
Applied Materials rolls out new CVD and PVD systems for IGZO-based displays
10/17/2013 Applied Materials introduced three new tools for the display market aimed at metal oxide thin film transistors.
Argument for not cleaning up process water is wafer thin
10/17/2013 When facilities management and water treatment company MSS Group was called in to clean up the process water in a globally renowned manufacturer of semiconductor wafers, the company was presented with an untreated water system suffering from significant corrosion.
Applied Materials launches new metal oxide display tech
10/16/2013 Applied Materials, Inc. today announced new technology systems for manufacturing large size and ultra-high definition (UHD) LCD and OLED displays that meet the demand for greater screen performance, clarity, color and brightness.
Laser thermal anneal to boost performance of 3D memory devices
10/16/2013 Nanoelectronics research center imec and Excico have successfully demonstrated the application of laser thermal anneal (LTA) to boost the current in vertical polysilicon channel devices for 3D memory.
AMOLED panel shipments surge in Q2
10/16/2013 Largely driven by demand from upscale Samsung smartphones, particularly the Galaxy S4, global shipments of high-end active-matrix organic light-emitting diode (AMOLED) display panels posted impressive sequential growth of 16 percent in the second quarter.
Model-based hints: GPS for LFD success
10/16/2013 For several technology nodes now, designers have been required to run lithography-friendly design (LFD) checks prior to tape out and acceptance by the foundry. Due to resolution enhancement technology (RET) limitations at advanced nodes, we are seeing significantly more manufacturing issues, even in DRC-clean designs.
Intersil appoints Roger Wendelken as senior VP of worldwide sales
10/15/2013 Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the appointment of Roger Wendelken as senior vice president of worldwide sales effective immediately.
Rising demand for array IC packaging
10/15/2013 Small form factor, high speed and performance, and high bandwidth capability with low battery consumption are desired traits for many packaging solutions for integrated circuits (ICs).
IBM develops sub-20nm nanofluidic channels for lab-on-chip
10/15/2013 At IEDM, IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.
Marrying diversification, innovation with high-volume manufacturing – the MEMS puzzleMORE ANALYSIS & FEATURES
10/08/2013 Initiated by Apple’s launch of the iPhone, the subsequent explosive growth of the smartphone market has provided the MEMS industry with one of its biggest opportunities to supply high-volume demand. But if motion sensing in our portable electronics – enabled by accelerometer and gyroscope MEMS applications for example – is the tip of the iceberg for MEMS technology how can the semiconductor industry ensure that high volume markets like consumer electronics benefit from all that MEMS potentially has to offer.
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