10/18/2013  Wireless video, network interfaces, multi-format decoders, LED backlighting boost average semiconductor content per TV.

10/17/2013  ParkerVision, Inc., a developer and marketer of semiconductor technology solutions for wireless applications, today announced that a jury in the U.S. District Court for the Middle District of Florida found Qualcomm Incorporated guilty of direct and indirect infringement of ParkerVision patents.

10/17/2013  MEMS Technology Showcase will give MEMS Executive Congress US attendees an intimate look at some of the most unique and inspiring MEMS-enabled applications in the business. After a competitive application process, MEMS Industry Group (MIG) has selected five finalists that show how MEMS enhances the consumer experience, highlighting the “MEMS inside the machine.”

10/17/2013  Nov 7 at 3 PM ET. Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

10/17/2013  Applied Materials introduced three new tools for the display market aimed at metal oxide thin film transistors.

10/17/2013  When facilities management and water treatment company MSS Group was called in to clean up the process water in a globally renowned manufacturer of semiconductor wafers, the company was presented with an untreated water system suffering from significant corrosion.

10/16/2013  Applied Materials, Inc. today announced new technology systems for manufacturing large size and ultra-high definition (UHD) LCD and OLED displays that meet the demand for greater screen performance, clarity, color and brightness.

10/16/2013  Nanoelectronics research center imec and Excico have successfully demonstrated the application of laser thermal anneal (LTA) to boost the current in vertical polysilicon channel devices for 3D memory.

10/16/2013  Largely driven by demand from upscale Samsung smartphones, particularly the Galaxy S4, global shipments of high-end active-matrix organic light-emitting diode (AMOLED) display panels posted impressive sequential growth of 16 percent in the second quarter.

10/16/2013  For several technology nodes now, designers have been required to run lithography-friendly design (LFD) checks prior to tape out and acceptance by the foundry. Due to resolution enhancement technology (RET) limitations at advanced nodes, we are seeing significantly more manufacturing issues, even in DRC-clean designs.

10/15/2013  Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the appointment of Roger Wendelken as senior vice president of worldwide sales effective immediately.

10/15/2013  Small form factor, high speed and performance, and high bandwidth capability with low battery consumption are desired traits for many packaging solutions for integrated circuits (ICs).

10/15/2013  At IEDM, IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.

10/08/2013  Initiated by Apple’s launch of the iPhone, the subsequent explosive growth of the smartphone market has provided the MEMS industry with one of its biggest opportunities to supply high-volume demand. But if motion sensing in our portable electronics – enabled by accelerometer and gyroscope MEMS applications for example – is the tip of the iceberg for MEMS technology how can the semiconductor industry ensure that high volume markets like consumer electronics benefit from all that MEMS potentially has to offer.