Flexible Displays

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FLEXIBLE DISPLAYS ARTICLES



Two quantum dots are better than one: Using one dot to sense changes in another

09/19/2018  Osaka University-based collaboration fabricates the first nanoelectronic device that can detect single-electron events in a target quantum dot using a second dot as a sensor.

FLEX/MSTC 2019 Call for Papers deadline is September 28, 2018

09/19/2018  Educate the industry with the latest in flexible, hybrid and printed electronic innovations OR sensor systems enabling autonomous mobility.

Tight supplies impede LCD panel cost reduction in third quarter of 2018

09/10/2018  Tight supplies of display panel materials and components, such as driver integrated circuit (IC), glass substrate and polarizer, are expected to slow the decline rate of liquid crystal display panel costs.

Universal Display Corporation announces recipients of the 2018 UDC Innovative Research and Pioneering Technology Awards at IMID Korea

08/31/2018  These awards were presented at the 18th International Meeting of Information Display (IMID) conference on August 30, 2018 in Busan, Korea by Dr. Julie Brown, Senior Vice President and Chief Technology Officer of Universal Display.

SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

Shipments of flexible AMOLED panels expected to exceed rigid panels by 2020

08/13/2018  Amid growing demand for active matrix organic light-emitting diode (AMOLED) panels for smartphones, shipments of flexible AMOLED panels are expected to account for more than 50 percent of total AMOLED panel shipments by 2020.

Tokyo Tech Hosono's story of IGZO TFT development features in Nature Electronics

07/25/2018  Each issue of the journal Nature Electronics contains a column called 'Reverse Engineering,' which examines the development of an electronic device now in widespread use from the viewpoint of the main inventor. The July 2018 column tells the story of the IGZO thin film transistor (TFT) through the eyes of Professor Hideo Hosono of Tokyo Tech's Institute of Innovative Research (IIR), who is also director of the Materials Research Center for Element Strategy.

Future electronic components to be printed like newspapers

07/20/2018  A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.

SEMICON West 2018 highlights smart technologies, workforce development, industry growth

07/09/2018  Smart technologies take center stage tomorrow as SEMICON West, the flagship U.S. event for connecting the electronics manufacturing supply chain, opens for three days of insights into leading technologies and applications that will power future industry expansion.

AMD celebrates breakthrough successes in 2017 by recognizing key suppliers

06/25/2018  AMD (NASDAQ:AMD) today announced awards for key suppliers that contributed to the successful launch of 10 new high-performance computing and graphics product families in 2017.

SEMI-FlexTech invites proposals for flexible hybrid electronics advances

06/19/2018  FlexTech, a SEMI Strategic Association Partner, is now soliciting proposals for projects that advance flexible hybrid electronics (FHE) for sensors, power and other key electronic components.

Transparent, conductive films promising for developing flexible screens

06/07/2018  Researchers demonstrate silver-based electrode films that could be used for flexible touch displays, televisions and solar cells.

Global, U.S. electronics supply chains see healthy midyear business conditions

05/18/2018  The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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