Flexible Displays

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FLEXIBLE DISPLAYS ARTICLES



Transparent, conductive films promising for developing flexible screens

06/07/2018  Researchers demonstrate silver-based electrode films that could be used for flexible touch displays, televisions and solar cells.

Global, U.S. electronics supply chains see healthy midyear business conditions

05/18/2018  The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

LG Display retains its lead in area shipments of large displays in first quarter of 2018

05/15/2018  Large display panel shipments show better-than-expected results compared to previous first quarters.

Researchers offer new technology for liquid-crystal displays

05/11/2018  An international research team from Russia, France, and Germany has proposed a new method for orienting liquid crystals.

Tech bends light more efficiently, offers wider angles for light input

05/08/2018  Engineering and physics researchers at North Carolina State University have developed a new technology for steering light that allows for more light input and greater efficiency - a development that holds promise for creating more immersive augmented-reality display systems.

Shipment area of AMOLED panel expected to more than quadruple by 2024

04/23/2018  With demand growing for active matrix organic light-emitting diode (AMOLED) TV panels, shipments of overall AMOLED panels by area is forecast to more than quadruple to 22.4 million square meters by 2024 from 5.0 million square meters in 2017.

Demand for higher resolution oxide panels expected to grow 30% in 2018

04/19/2018  Rise in LCD and OLED display applications has contributed to momentum in demand growth for panels using this technology.

Flexible TVs and high performance wearable smart tech one step closer

04/19/2018  Flexible televisions, tablets and phones as well as 'truly wearable' smart tech are a step closer thanks to a nanoscale transistor created by researchers at The University of Manchester and Shandong University in China.

AMOLED panel demand in smartphone market expected to grow much slower than expected

04/16/2018  After showing triple-digit growth in 2017, flexible AMOLED panel is only expected to grow 34 percent in 2018 compared to the previous year.

U.S. federal government R&D spending for 2018 finalized

04/06/2018  Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year.

Market for organic materials used to manufacture OLED panels showed remarkable growth in second half of 2017

03/28/2018  Revenue of OLED materials increased by 20 percent in second half of 2017, following a slump from 2016.

U.S. trade tensions with China hit fever pitch

03/21/2018  Stiff tariffs and the dismantling of longstanding trade agreements – cornerstones of these new actions – will ripple through the semiconductor industry with particularly damaging effect.

SEMICON West 2018 to spotlight smart technologies, workforce development

03/20/2018  SEMICON West has opened registration for the July 10-12, 2018, exposition at the Moscone Center in San Francisco, California.

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Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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