Flexible Displays

FLEXIBLE DISPLAYS ARTICLES



SEMICON Europa moves to Munich: Empowering innovation and shaping the value chain

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.

Driven by TV size migration, large TFT display market continues to grow 6% by area in 2017

09/15/2017  The large thin film transistor (TFT) display market is expected to continue to expand in 2017 despite slower end-market demand, according to IHS Markit.

Flex Logix joins TSMC IP Alliance Program

09/05/2017  Flex Logix Technologies, Inc., the supplier of embedded FPGA IP and software, today announced that it has joined the TSMC IP Alliance Program included in TSMC's Open Innovation Platform.

Flexible hybrid electronics & sensors impacting the automotive industry

09/05/2017  FlexTech, a SEMI strategic association partner, will host a one-day Flexible Hybrid Electronics and Sensors Automotive Industry workshop in Detroit, Michigan on September 13, 2017 to explore how FHE adds functionality, decreases weight and impacts design. Automotive and electronics industry leaders will gather to discuss the market demands and challenges with automotive technology and present disruptive changes brought by flexible hybrid electronics (FHE) and sensors.

Ultrathin Layers with Large Contact Area on Carbon Fibers as High-Performance Electrode

08/15/2017  To meet the novel functions of next-generation electronics, including foldable displays, flexible power sources are needed.

Ultrathin device harvests electricity from human motion

07/24/2017  A new electrochemical energy harvesting device developed at Vanderbilt University can generate electrical current from the full range of human motions and is thin enough to embed in clothing.

AMOLED panel market to surge 63% in 2017

07/20/2017  The global active-matrix organic light-emitting diode (AMOLED) panel market is forecast to surge 63 percent in 2017 from a year ago to $25.2 billion on growing demand for AMOLED panels in the smartphone and TV industries.

AMOLED fine metal mask market expected to reach $1.2B by 2022

07/20/2017  As active-matrix organic light-emitting diode (AMOLED) displays quickly displace liquid crystal displays (LCDs) in smartphones, panel makers are rapidly adding new production capacity, accelerating the demand for the fine metal mask.

Taiwan largest semiconductor materials market, as SEMICON Taiwan approaches

07/19/2017  Taiwan is the world's largest consumer of semiconductor materials for the seventh consecutive year, bringing new opportunities in this increasingly critical sector.

New class of 'soft' semiconductors could transform HD displays

06/29/2017  Berkeley Lab researchers find tunable halide perovskites could usher in new generation of optoelectronic devices.

To connect biology with electronics, be rigid, yet flexible

06/19/2017  Researchers uncover design principles to make polymers that can transport both ions and electrons.

The first nanometrically-sized superelastic alloy

06/09/2017  UPV/EHU-University of the Basque Country's researchers have explored superelasticity properties on a nanometric scale based on shearing an alloy's pillars down to nanometric size.

2017FLEX Monterey focuses on accelerating to manufacturing as industry growth escalates

05/15/2017  FlexTech's annual Flexible Electronics Conference and Exhibit -- 2017FLEX -- is set for the Hyatt Regency Hotel & Spa in Monterey, Calif. from June 19-22, 2017.

2017FLEX Korea: First flexible hybrid electronics conference in Korea

05/10/2017  Today FlexTech, A SEMI Strategic Association Partner, announced the full agenda for the inaugural flexible hybrid electronics (FHE) conference coming up on May 31-June 1 in Seoul at COEX Exhibition Center.

Tianma selects Orbotech solutions for its flex AMOLED Gen 6 fab

05/08/2017  Orbotech Ltd. announced today that Tianma Micro-electronics Co. Ltd. has selected Orbotech's ArrayChecker and Automated Optical Inspection (AOI) solutions for its production line upgrade to flexible AMOLED technology.

Flexible, organic and biodegradable: Stanford researchers develop new wave of electronics

05/02/2017  A new semiconductor developed by Stanford researchers is as flexible as skin and easily degradable. It could have diverse medical and environmental applications, without adding to the mounting pile of global electronic waste.

ASML, ZEISS file joint patent infringement lawsuits against Nikon

04/28/2017  ASML and ZEISS today announced that both companies are filing initial legal claims against Nikon for infringement of more than 10 patents.

Wonder material? Novel nanotube structure strengthens thin films for flexible electronics

04/24/2017  Reflecting the structure of composites found in nature and the ancient world, researchers at the University of Illinois at Urbana-Champaign have synthesized thin carbon nanotube (CNT) textiles that exhibit both high electrical conductivity and a level of toughness that is about fifty times higher than copper films, currently used in electronics.

New quantum liquid crystals may play role in future of computers

04/21/2017  New state of matter may have applications in ultrafast quantum computers.

Spray-on memory could enable bendable digital storage

04/04/2017  Nanowire ink enables flexible, programmable electronics on materials like paper, plastic or fabric.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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