March 6, 2012 – PRNewswire — Flip chip bumping and wafer-level packaging (WLP) supplier FlipChip International (FCI) signed a set of license, sales, and marketing agreements with NANIUM S.A., semiconductor manufacturing, test and engineering services provider, for 300mm flip chip bumping and WLP.
The partnership revolves around NANIUMâ€™s 300mm WLP services and FCI turnkey bump services for 150mm and 200mm wafers. NANIUM will license the FCI Spheron plated copper (Cu) redistribution technology, adding fan-in wafer-level packaging (FIWLP) and wafer-level chipscale packaging (WLCSP) technologies to its portfolio of fan-out WLP (FOWLP). "Together, FCI and NANIUM offer a complete WLP service portfolio covering 150, 200 and 300mm wafer sizes," summarized Armando Tavares, NANIUM president of Executive Board.
NANIUM signed a similar technology agreement with Tessera Inc. in 2010.
The companies have an eye on next-generation packaging needs for high-performance/small form factor semiconductors in smartphones, medical devices, tablets, automotive ICs, graphics processors, microprocessors, and wireless 3G/4G integrated products. WLP and flip chips are gaining "global strategic importance," said Bob Forcier, FCI president and CEO.
NANIUM provides package and system design, development, manufacturing, testing and engineering services in the semiconductor business, operating mainly in WLP. NANIUM also offers packaging based on laminated organic substrates and metal leadframes. Website: www.nanium.com.
FCI provides products and services for the wafer bumping and wafer level packaging market. FCI is a subsidiary of RoseStreet Labs LLC, a supplier of products and services for the semiconductor, renewable energy and life science markets. Website: www.flipchip.com.
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