FPDs and TFTs

FPDS AND TFTS ARTICLES



SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

Shipments of flexible AMOLED panels expected to exceed rigid panels by 2020

08/13/2018  Amid growing demand for active matrix organic light-emitting diode (AMOLED) panels for smartphones, shipments of flexible AMOLED panels are expected to account for more than 50 percent of total AMOLED panel shipments by 2020.

SEMI testifies against U.S. tariffs; Members meet with congressional leaders urging trade action

07/30/2018  Two months after opposing $34 billion in U.S. trade tariffs on behalf of the U.S. semiconductor manufacturing industry, Jonathan Davis, global vice president of industry advocacy at SEMI, this week spoke out against an additional $16 billion duties on Chinese goods.

Tokyo Tech Hosono's story of IGZO TFT development features in Nature Electronics

07/25/2018  Each issue of the journal Nature Electronics contains a column called 'Reverse Engineering,' which examines the development of an electronic device now in widespread use from the viewpoint of the main inventor. The July 2018 column tells the story of the IGZO thin film transistor (TFT) through the eyes of Professor Hideo Hosono of Tokyo Tech's Institute of Innovative Research (IIR), who is also director of the Materials Research Center for Element Strategy.

Future electronic components to be printed like newspapers

07/20/2018  A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.

Long-term oversupply of large TFT LCD panels will prompt restructuring of older fabs

07/19/2018  Large thin-film transistor liquid crystal display (TFT LCD) panel makers are expected to reduce production of comparatively smaller sized 32-, 40- and 43-inch panels, helping to stabilize panel prices in the third quarter of 2018.

Smartphone displays set to move rapidly to 18:9 and wider aspect ratios in second half of 2018

07/17/2018  With every smartphone brand applying the 18:9 and wider aspect ratio screens to its newer models, the rate of adoption is expected to quicken in the second half of 2018.

South Korean and Chinese TV makers to increase panel purchases in third quarter despite concerns

07/13/2018  Despite concerns about TV demand and falling profit margins, major South Korean and Chinese TV makers are expected to stock up on display panels in the third quarter to prepare for the seasonal year-end shopping spree by consumers.

GlobalFoundries to deliver Socionext's next gen graphics controller for automotive displays

06/28/2018  GLOBALFOUNDRIES today announced that Socionext Inc. will manufacture the third and latest generation of its graphics display controllers, the SC1701, on GF's 55nm Low Power Extended (55LPx) process technology with embedded non-volatile memory.

AMD celebrates breakthrough successes in 2017 by recognizing key suppliers

06/25/2018  AMD (NASDAQ:AMD) today announced awards for key suppliers that contributed to the successful launch of 10 new high-performance computing and graphics product families in 2017.

Accumulated gap in LCD TV set and panel shipments expected to hit a 10-year high in coming quarters

06/22/2018  Despite better-than-expected first-quarter demand for thin-film transistor liquid-crystal display (TFT-LCD) TV sets and TV panels, market players would be well advised to adopt a more conservative outlook in demand growth for the coming quarters, according to IHS Markit.

Global demand and supply for automotive display systems expected to maintain healthy growth in 2018

06/18/2018  The global demand for automotive display systems is expected to continue a strong growth path in 2018, according to recent analysis from business information provider IHS Markit.

Gartner reports worldwide sales of smartphones returned to growth in first quarter of 2018

05/31/2018  Global sales of smartphones to end users returned to growth in the first quarter of 2018 with a 1.3 percent increase over the same period in 2017, according to Gartner, Inc.

Smartphone display with notch design estimated to cost about 20% more

05/31/2018  Notch design of smartphone displays is estimated to raise manufacturing cost of display panels by more than 20 percent.

Gases: Essential materials for display manufacturing

05/21/2018  Technology trends in backplane technology are driving higher gas demand in display manufacturing. Specific gas requirements of process blocks are discussed, and various supply modes are reviewed.

Global, U.S. electronics supply chains see healthy midyear business conditions

05/18/2018  The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

LG Display retains its lead in area shipments of large displays in first quarter of 2018

05/15/2018  Large display panel shipments show better-than-expected results compared to previous first quarters.

Researchers offer new technology for liquid-crystal displays

05/11/2018  An international research team from Russia, France, and Germany has proposed a new method for orienting liquid crystals.

Tech bends light more efficiently, offers wider angles for light input

05/08/2018  Engineering and physics researchers at North Carolina State University have developed a new technology for steering light that allows for more light input and greater efficiency - a development that holds promise for creating more immersive augmented-reality display systems.

Shipment area of AMOLED panel expected to more than quadruple by 2024

04/23/2018  With demand growing for active matrix organic light-emitting diode (AMOLED) TV panels, shipments of overall AMOLED panels by area is forecast to more than quadruple to 22.4 million square meters by 2024 from 5.0 million square meters in 2017.




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WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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VIDEOS