By Dr. Phil Garrou, Contributing Editor
Continuing our look at 2014 SEMICON Taiwan.
YH Chen of Unimicron addressed â€śPanel Level Embedded Substrate Technology.â€ť
Unimicron puts forth a proposal that embedded packaging saves cost because it (a) decreases the substrates used,(b) decreases the area of HDI board needed, (c) better electrical performance due to the proximity of the chips.
Unimicron started embedded passives technology (EPS) in 2009 and moved to HVM in 2012. This is based on burying MLC (multilayer caps).
Buried chip technology called EAS has the following roadmap:
They are also looking at embedded hea â€śslugsâ€ť to increase thermal performance.
Line Embedded technology (LE) uses lasers to creat fine fetures that are then plated up and CMPed to give L/s as low as 8/8um.
In another cost reduction development project, they are looking at combining the non organic interposer and the organic substrate into what they call â€śflip chip embedded intrposer carrierâ€ť as shown below.
Azemar of Yole Developpement looked at â€śFan-out & Embedded DiesÂ Technologies and market trends.â€ť
Azemar explained again that 2 different approaches are developing for Embedded packages, i.e. FOWLP based on reconfigured molded wafers and embedded die based on PCB laminate materials and infrastructure.
Currently Nanium and StatsChipPAC hold > 80% of the FOWLP market though this is expected to change when TSMC fully enters the market with their InFo-WLP technology.
A generic embedded die packaging flow is shown below.
For embedded die packaging, a new supply chain is required since the die embedding will be done by the PCB manufacturer who is making the substrate.
AT&S appears to hold ~ 80% of the embedded de market. They initiated this space with the TDK DC_DC converter package but Yole reports very little HVM since then.
At the CFO Executive Summit Strohbecke of MicronÂ looked at â€śMicron Technology and the Changing Dynamics of the Memory Semiconductor Industry: Their 2014 vs 2018 assessment of DRAM demand vs application shows an increase in mobile and server/networking at the expense of PC memory.
For all the latest in 3DIC and advanced packaging, stay linked to IFTLEâ€¦
Thanks for great illustrations of an evolving technology dealing with supply chain decision issues as well as customer need divergences.
More ways to integrate circuits.
Performance and reliability will keep these ideas alive as cost settles the market share issues later.