Insights From Leading Edge

IFTLE 288 Consolidation on the Conference Circuit: 2016 IMAPS Polymer Conf

By Dr. Phil Garrou, Contributing Editor

Conference Consolidation under IMAPS

Recently, consolidation has hit the conference circuit, much the same as it has hit the corporate world. The 2016 IMAPS Polymers Conference which we will discuss below focuses, as you might imagine, on the use of polymers in microelectronics. It has been a biennial conference sponsored 15X by DuPont and was held in Wilmington DE. It was acquired by IMAPS and for now continues to operate at the Wilmington location.

IMAPS has also acquired the RTI 3D ASIP Conference. As you may know, 3DASIP is the longest running 2.5 / 3DIC conference focused on commercialization and infrastructure. The IMAPS supported 2016 meeting will be held December 13-15th, at the Marriott San Francisco Airport Hotel in Burlingame, Ca. As in years past, all presentations will be invited.

Continuing in the technical direction that was started last year, 3D ASIP will grow its focus on not only 2.5 and 3D IC, but other competitive high density packaging technologies that are being developed. With the ending of the Ga Tech interposer conference they have asked Corning to join the polymer conference and provide a session on the status of this technology.

The US Technical Chair will be Alan Huffman from RTI, the European Chair will be Mark Scannell of Leti and the Asia Chair will be Mitsu Koyanagi of Tohoku Univ.

There will be two AM tutorials, plenary presentations to start off each day and (8) sessions structured and developed by 8 “topic leaders” who will develop their 3 or 4 paper sessions and serve as session chairs.

IMAPS 17th Symp on Polymers for Microelectronics.

Continuing in the Winterhaven DE site that has held these meeting for many hears, the conference was spearheaded by a 6 person steering committee and a 6 person advisory board.

Yole Developpement

Amandine Pizzagalli of Yole gave a nice presentation on the use of polymers in advanced packaging platforms. The following generic packaging slide first breaks down technology options into leadframe packages vs substrate based and non substrate based packages etc. Another conclusion from this slide which John Hunt made in a later talk was that ALL packages are fan out except wafer level packages.

yole 1

Their wafer count forecast shows that while fan out shows the strongest growth rate, FC based packaging is responsible for > 75% of all adv packaging wafer count through 2020.

yole 2

Yole’s 2015 marketing study shows that PI accounts for ~ 63% of dielectric usage in advanced packaging.

yole 3

ASE – Fan Out Packaging

In the fanout panel packaging session John Hunt of ASE made the point that while fan out today has taken the connotation of “eWLB” packaging, it truly has been around forever since all packaging except wafer level is fan out including all leadframe and substrate packaging. He showed the following chart for ASE fan out package offerings ad noted that ASE like many others were focusing on panel level processing to attempt to cut costs.

yole 4


For all the latest on 3DIC and other advanced packaging, stay linked to IFTLE…


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